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參數(shù)資料
| 型號： | celeron processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit Celeron Processor Mobile Module(32 位帶移動模塊處理器) |
| 中文描述： | 32位賽揚(yáng)處理器的移動模塊（32位帶移動模塊處理器） |
| 文件頁數(shù)： | 57/64頁 |
| 文件大?。?/td> | 799K |
| 代理商： | CELERON PROCESSOR |
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Celeron
Processor Mobile Module MMC-2
at 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz
243357-004
Datasheet
51
6.1.3
Height Restrictions
Figure 20
shows the mechanical stack-up and the associated component clearance requirements.
This is the module keep-out zone and should not be entered. The system manufacturer establishes
board-to-board clearance between the mobile module and the system electronics by selecting one
of three mating connectors available in heights of approximately 4 mm, 6 mm, and 8 mm. The
three sizes provide flexibility in choosing the system electronics components between the two
boards. Information on these connectors can be obtained from your Intel Field Representative.
Figure 20. Keep-out Zone
6.2
Thermal Transfer Plate
A thermal transfer plates (TTP) provide heat dissipation on the processor and the 82443BX. The
TTP may vary on different generations of Intel mobile modules. The TTP provides the thermal
attach point where a system manufacturer can transfer heat through the notebook system using a
heat pipe, a heat spreader plate, or a thermal solution. Attachment dimensions for the thermal
interface block to the TTP are provided in
Figure 21
,
Figure 22
, and
Figure 23
. The TTP on the
mobile module is designed to be a high efficiency spreader. To fully take advantage of the mobile
module thermal design and optimize the system thermal performance, the contact area (Ac) needs
to be a minimum of 30 mm x 30 mm. While it crucial to maximize the contact area, it is equally
important to ensure that the contact area and/or the mobile module is free from warpage in an
assembled configuration.
Warning:
If warpage occurs, the thermal resistance of the mobile module could be adversely affected.
When attaching the mating block to either TTP, Intel recommends that a thermal elastomer be used
as an interface material. This material reduces the thermal resistance. The system thermal interface
block should be secured with M2 screws using a maximum torque of 1.5 Kg*cm to 2.0 Kg*cm
(equivalent to 0.147 N*m to.197 N*m). The thread length of the M2 screws should be 2.25-mm
Note 3
Note 3
NOTES:
1.
2.
All values are nominal unless otherwise specified.
3D CAD model (PRO/E Native) Available upon
request.
These dimensions have changed.
3.
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