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參數(shù)資料
| 型號： | celeron processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit Celeron Processor Mobile Module(32 位帶移動模塊處理器) |
| 中文描述： | 32位賽揚處理器的移動模塊（32位帶移動模塊處理器） |
| 文件頁數(shù)： | 4/64頁 |
| 文件大?。?/td> | 799K |
| 代理商： | CELERON PROCESSOR |
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Celeron
Processor Mobile Module MMC-2
at 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz
iv
Datasheet
243357-004
5.3.3
5.3.4
Power Planes: Bulk Capacitance Requirements....................................35
Surge Current Guidelines.......................................................................36
5.3.4.1 DC Power System Protection....................................................36
5.3.4.2 V_DC Power Supply..................................................................37
5.3.4.3 Overcurrent Protection..............................................................37
5.3.4.4 Current Limit Shift Point ............................................................39
5.3.4.5 Slew Rate Control .....................................................................41
5.3.4.6 Undervoltage Lockout ...............................................................43
5.3.4.7 Overvoltage Lockout .................................................................44
Active Thermal Feedback ...................................................................................48
Thermal Sensor Configuration Register..............................................................48
5.4
5.5
6.0
Mechanical Specification..................................................................................................49
6.1
Mobile Module Dimensions.................................................................................49
6.1.1
Pin 1 Location of the MMC-2 Connector................................................49
6.1.2
Printed Circuit Board..............................................................................50
6.1.3
Height Restrictions.................................................................................51
6.2
Thermal Transfer Plate .......................................................................................51
6.3
Mobile Module Physical Support.........................................................................53
6.3.1
Mobile Module Mounting Requirements.................................................53
6.3.2
Mobile Module Weight............................................................................54
7.0
Thermal Specification.......................................................................................................55
7.1
Thermal Design Power........................................................................................55
8.0
Labeling Information.........................................................................................................56
9.0
Environmental Standards.................................................................................................58
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Celeron Processor Mobile Module Block Diagram................................................3
MMC-2 Connector Pad Footprint ........................................................................18
Clock Control States ...........................................................................................23
BCLK Waveform at the Processor Core Pins .....................................................29
VR Efficiency Chart.............................................................................................31
Power Sequence Timing.....................................................................................34
V_DC Ripple Current ..........................................................................................36
V_DC Power System Protection Block Diagram.................................................37
Overcurrent Protection Circuit.............................................................................38
Current Shift Model.............................................................................................39
Undervoltage Lockout .........................................................................................43
Undervoltage Lockout Model ..............................................................................44
Overvoltage Lockout ...........................................................................................45
Overvoltage Lockout Model ................................................................................45
Recommended Power Supply Protection Circuit for the System Electronics .....47
Simulation of V_DC Voltage Skew......................................................................47
Board Dimensions and MMC-2 Connector Orientation.......................................49
Board Dimensions and MMC-2 Connector—Pin 1 Orientation...........................50
Printed Circuit Board Thickness..........................................................................50
Keep-out Zone ....................................................................................................51
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