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參數(shù)資料
| 型號： | celeron processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit Celeron Processor Mobile Module(32 位帶移動模塊處理器) |
| 中文描述： | 32位賽揚(yáng)處理器的移動模塊（32位帶移動模塊處理器） |
| 文件頁數(shù)： | 5/64頁 |
| 文件大?。?/td> | 799K |
| 代理商： | CELERON PROCESSOR |
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243357-004
Datasheet
v
Celeron
Processor Mobile Module MMC-2
at 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz
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82443BX Thermal Transfer Plate (Reference Only) ...........................................52
82443BX Thermal Transfer Plate Detail..............................................................52
CPU Thermal Transfer Plate (Reference Only)...................................................53
Standoff Holes, Board Edge Clearance, and EMI Containment Ring .................54
Product Tracking Code........................................................................................57
Tables
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Connector Signal Summary ..................................................................................4
Memory Signals.....................................................................................................5
AGP Signal Descriptions.......................................................................................6
PCI Signal Description ..........................................................................................8
Processor and PIIX4E/M Sideband Signal Description.......................................10
Power Management Signal Descriptions ............................................................11
Clock Signal Definitions.......................................................................................12
Voltage Descriptions ...........................................................................................13
ITP and JTAG Pins..............................................................................................14
Miscellaneous Pins..............................................................................................14
Connector Pin Assignment..................................................................................15
Connector Specifications.....................................................................................18
Configuration Straps for the 82443BX Host Bridge System Controller...............20
Clock State Characteristics.................................................................................22
Power Consumption Values I .............................................................................26
Power Consumption Values II.............................................................................26
Power Consumption Values II.............................................................................27
BCLK DC Specifications......................................................................................28
BCLK AC Specifications at the Processor Core Pins..........................................28
BCLK Signal Quality AC Specifications at the Processor Core...........................29
System Power Requirements..............................................................................30
Vcore Power Conversion Efficiency....................................................................31
Voltage Signal Definitions and Sequences .........................................................33
VR_ON In-rush Current.......................................................................................34
Bulk Capacitance Requirements.........................................................................35
Thermal Sensor SMBus Address........................................................................48
Thermal Sensor Configuration Register..............................................................48
Thermal Design Power (TDP MODULE ) Specification ......................................55
Environmental Standards....................................................................................58
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