參數(shù)資料
型號： celeron processor
廠商： Intel Corp.
英文描述： 32 bit Celeron Processor Mobile Module(32 位帶移動模塊處理器)
中文描述： 32位賽揚處理器的移動模塊（32位帶移動模塊處理器）
文件頁數(shù)： 59/64頁
文件大?。?/td> 799K
代理商： CELERON PROCESSOR
Celeron
Processor Mobile Module MMC-2
at 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz
243357-004
Datasheet
53
Figure 23. CPU Thermal Transfer Plate (Reference Only)
6.3
Mobile Module Physical Support
6.3.1
Mobile Module Mounting Requirements
Three mounting holes are available for securing the mobile module to the system base or the
system electronics. See
Figure 17
for mounting hole locations. These hole locations and board edge
clearances will remain fixed for all Intel mobile modules. All three mounting holes should be used
to ensure long term mechanical reliability and EMI integrity of the system. The board edge
clearance includes a 0.762-mm (0.030 inches) wide EMI containment ring around the perimeter of
the module. This ring is on each layer of the module PCB and is grounded. The hole patterns also
have a plated surrounding ring to use a metal standoff for EMI shielding purposes. Standoffs
should be used to provide support for the installed mobile module. However, the warpage of the
baseboard can vary and should be calculated into the final dimensions of the standoffs used. All
calculations can be made with the
Intel
MMC-2 Standoff/Receptacle Height Spreadsheet
.
Information on this spreadsheet can be obtained from your local Intel representative.
Figure 24
shows the standoff support hole details, the board edge clearance, and the dimensions of
the EMI containment ring. No components are placed on the board in the keep-out area.
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