參數(shù)資料
型號: ST7FLIT19B
廠商: 意法半導(dǎo)體
英文描述: 8-Bit MCU With Single Voltage Flash Memory, Data EEPROM, ADC, 5 Timers, SPI(內(nèi)部RC,PLL,ADC,ROP,ICP, IAP,SPI的8位MCU)
中文描述: 8位微控制器單電壓閃存存儲器,數(shù)據(jù)EEPROM,模數(shù)轉(zhuǎn)換器,5計時器和SPI(內(nèi)部鋼筋,鎖相環(huán),藝發(fā)局,人事,電感,國際檢察官聯(lián)合會的SPI的8位微控制器)
文件頁數(shù): 145/155頁
文件大小: 2968K
代理商: ST7FLIT19B
ST7LITE1xB
145/155
14.2 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK
TM
.
ECOPACK
TM
packages are qualified according
to the JEDEC STD-020C compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACK
TM
transition program is available on
www.st.com/stonline/leadfree/, with specific
technical Application notes covering the main
technical
aspects
conversion
(AN2033,
AN2036).
related
AN2034,
to
lead-free
AN2035,
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
TM
TQFP, SDIP, SO and QFN20
packages are fully compatible with Lead (Pb)
containing soldering process (see application
note AN2034)
– TQFP, SDIP and SO Pb-packages are compati-
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Table 25. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
Package
Plating material devices
Sn (pure Tin)
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
Pb solder paste
Yes
Yes
Yes
Pb-free solder paste
Yes *
Yes *
Yes *
SDIP & PDIP
QFN
TQFP and SO
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