- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382635 > TMP20F2810PBKAEP (Texas Instruments, Inc.) Digital Signal Processors PDF資料下載
參數(shù)資料
| 型號(hào)： | TMP20F2810PBKAEP |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 數(shù)字信號(hào)處理 |
| 英文描述： | Digital Signal Processors |
| 中文描述： | 數(shù)字信號(hào)處理器 |
| 文件頁數(shù)： | 11/159頁 |
| 文件大小： | 2084K |
| 代理商： | TMP20F2810PBKAEP |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁當(dāng)前第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁
Features
11
March 2004 Revised October 2004
SGUS051A
1
Features
Controlled Baseline
One Assembly/Test/Fabrication Site
Extended Temperature Performance of
55
°
C to 125
°
C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree
High-Performance Static CMOS Technology
150 MHz (6.67-ns Cycle Time)
Low-Power (1.8-V Core @135 MHz, 1.9-V
Core @150 MHz, 3.3-V I/O) Design
JTAG Boundary Scan Support
High-Performance 32-Bit CPU (320C28x)
16 x 16 and 32 x 32 MAC Operations
16 x 16 Dual MAC
Harvard Bus Architecture
Atomic Operations
Fast Interrupt Response and Processing
Unified Memory Programming Model
4M Linear Program/Data Address Reach
Code-Efficient (in C/C++ and Assembly)
320F24x/LF240x Processor Source Code
Compatible
On-Chip Memory
Flash Devices: Up to 128K x 16 Flash
(Four 8K x 16 and Six 16K x 16 Sectors)
ROM Devices: Up to 128K x 16 ROM
1K x 16 OTP ROM
L0 and L1: 2 Blocks of 4K x 16 Each
Single-Access RAM (SARAM)
H0: 1 Block of 8K x 16 SARAM
M0 and M1: 2 Blocks of 1K x 16 Each
SARAM
Boot ROM (4K x 16)
With Software Boot Modes
Standard Math Tables
External Interface (2812)
Up to 1M Total Memory
Programmable Wait States
Programmable Read/Write Strobe Timing
Three Individual Chip Selects
Clock and System Control
Dynamic PLL Ratio Changes Supported
On-Chip Oscillator
Watchdog Timer Module
Three External Interrupts
Peripheral Interrupt Expansion (PIE) Block
That Supports 45 Peripheral Interrupts
Three 32-Bit CPU-Timers
128-Bit Security Key/Lock
Protects Flash/ROM/OTP and L0/L1
SARAM
Prevents Firmware Reverse Engineering
Motor Control Peripherals
Two Event Managers (EVA, EVB)
Compatible to 240xA Devices
Serial Port Peripherals
Serial Peripheral Interface (SPI)
Two Serial Communications Interfaces
(SCIs), Standard UART
Enhanced Controller Area Network
(eCAN)
Multichannel Buffered Serial Port
(McBSP)
12-Bit ADC, 16 Channels
2 x 8 Channel Input Multiplexer
Two Sample-and-Hold
Single/Simultaneous Conversions
Fast Conversion Rate: 80 ns/12.5 MSPS
Up to 56 General Purpose I/O (GPIO) Pins
Advanced Emulation Features
Analysis and Breakpoint Functions
Real-Time Debug via Hardware
Development Tools Include
ANSI C/C++ Compiler/Assembler/Linker
Code Composer Studio
IDE
DSP/BIOS
Low-Power Modes and Power Savings
IDLE, STANDBY, HALT Modes Supported
Disable Individual Peripheral Clocks
Package Options
179-Ball MicroStar BGA
(GHH), (2812)
176-Pin Low-Profile Quad Flatpack
(LQFP) (PGF) (2812)
TMS320C24x, Code Composer Studio, DSP/BIOS, and MicroStar BGA are trademarks of Texas Instruments.
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range.
This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this
component beyond specified performance and environmental limits.
IEEE Standard 1149.11990, IEEE Standard Test-Access Port
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TMS320F2812PGFMEP | Digital Signal Processors |
| TMS320F2810PGFAEP | Digital Signal Processors |
| TMX20F2810PBKAEP | Digital Signal Processors |
| TMS320LC2404APGA | DSP CONTROLLERS |
| TMP320LC2401APAGA | DSP CONTROLLERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP2681P | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Telecommunication IC |
| TMP275 | 制造商:BB 制造商全稱:BB 功能描述:0.5∑C Digital Out Temperature Sensor |
| TMP275AID | 功能描述:板上安裝溫度傳感器 0.5C Dig Out Temp Sensor RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| TMP275AID | 制造商:Texas Instruments 功能描述:IC TEMP SENSOR 12BIT |
| TMP275AID | 制造商:Texas Instruments 功能描述:IC DIGITAL TEMP SENSOR |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。