參數(shù)資料
型號: JTS8388B
英文描述: JTS8388B [Updated 9/03. 47 Pages] ADC 8-bit 1 Gsps in die form
中文描述: JTS8388B [更新9 / 03。 47頁] ADC的8位1死GSPS的形式
文件頁數(shù): 42/47頁
文件大?。?/td> 785K
代理商: JTS8388B
42
JTS8388B
2104A–BDC–09/03
JTS8388B Thermal
Requirements
The JTS8388B is currently mounted on its dedicated Chip Evaluation Board (CEB),
which fulfills the device’s thermal requirements in still air at room temperature.
For operation in the military temperature range, forced convection is required to main-
tain the device junction temperature below the specified maximum value.
The JTS8388B’s power dissipation is 3.6 W at a 70
°
C junction temperature, and 3.8 W
at a 125
°
C junction temperature. The die dimensions are 2.44 mm x 3 mm = 7.32 mm
2
.
The maximum junction temperature is 145
°
C.
To correctly manage the power dissipation of the JTS8388B device, the following ther-
mal fixture profile is used, taking into account the die dimensions and power dissipation:
7.5
°
C/W typical value for die attach Ag filled Epoxy glue, but depending on glue film
thickness
0.5
°
C/W Copper block
1
°
C/W isolation foil
6.5
°
C/W heatsink (still air)
The heatsink used is the 3334B pin fin heatsink from Thermalloy (also used for cooling
the 604 Power PC μP). Its dimensions are 50.70 mm x 50.39 mm x 16.51 mm (1.996 “ x
1.984 “ x 0.650 “).
The measured die junction to ambient thermal resistance (RTHJA) for the Chip Evalua-
tion Board is approximately 15.5
°
C/W in still air.
At room temperature (25
°
C), this yields to a device junction temperature of approxi-
mately 80
°
C, in thermal steady-state conditions.
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