
GC4116 MULTI-STANDARD QUAD DUC CHIP
DATA SHEET REV 1.0
19992001
GRAYCHIP,INC.
- 46 -
APRIL 27, 2001
This document contains preliminary information which may be changed at any time without notice
6.7
APPLICATION NOTES
6.8
POWER AND GROUND CONNECTIONS
The GC4116 chip is a very high performance chip which requires solid power and ground connections to avoid noise on the
V
CC
, V
PAD
and GND pins. If possible the GC4116 chip should be mounted on a circuit board with dedicated power and ground
planes and with at least two decoupling capacitors (0.01
μ
f), one for V
CC
and one for V
PAD
adjacent to each side of the GC4116
chip. If dedicated power and ground planes are not possible, then the user should place decoupling capacitors across as many
V
CC
or V
PAD
and GND pairs as is practical.
IMPORTANT
The GC4116 chip may not operate properly if these power and ground guidelines are violated.
6.9
STATIC SENSITIVE DEVICE
The GC4116 chips are fabricated in a high performance CMOS process which is sensitive to the high voltage transients
caused by static electricity. These parts can be permanently damaged by static electricity and should only be handled in static
free environments. The parts are tested to exceed 2 Kv human body model.
6.10
MOISTURE SENSITIVE PACKAGE
The GC4016 come in level 2 moisture sensitive packages. Dry pack storage is required prior to assembly.
6.11
THERMAL MANAGEMENT
The parameters in Section 6.0 are tested at a junction temperature of 100
°
C. In any case, the junction temperature must
be kept below 125
°
C for reliable operation. To determine the junction temperature, the user should calculate the chip’s power
dissipation using the equation for supply current in Section 6.4 and then use the package’s thermal conductivity shown in Section
6.3. The junction temperature is calculated by adding the operating ambient temperature (or case temperature) to the product of
the power consumption times the thermal conductivity.
For example, the GC4116 chip operating in the GSM mode described in Section 7.8, consumes 0.XX Watts of power. The
junction to ambient rise of the 160 BGA package is XXX degrees per Watt. This represents a rise of 25 degrees over ambient.
This means that under these conditions the ambient temperature has to be less than 75
°
C to keep the junction temperature
below 100
°
C. Air flow will decrease the thermal resistance by 10% to 40%, allowing ambient temperatures between 78
°
C and
85
°
C. Increasing the decimation ratio (N) or decreasing the number of active channels (A) will also allow a higher ambient
temperature.