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參數(shù)資料
| 型號(hào)： | GC4116 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | MULTI-STANDARD QUAD DUC CHIP |
| 中文描述： | 多標(biāo)準(zhǔn)四數(shù)字上芯片 |
| 文件頁數(shù)： | 48/57頁 |
| 文件大小： | 401K |
| 代理商： | GC4116 |
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GC4116 MULTI-STANDARD QUAD DUC CHIP
DATA SHEET REV 1.0
19992001
GRAYCHIP,INC.
- 43 -
APRIL 27, 2001
This document contains preliminary information which may be changed at any time without notice
6.0
SPECIFICATIONS
6.1
ABSOLUTE MAXIMUM RATINGS
6.2
RECOMMENDED OPERATING CONDITIONS
6.3
THERMAL CHARACTERISTICS
Table 12: Absolute Maximum Ratings
CAUTION: Exceeding the absolute maximum ratings (min or max) may cause permanent damage to the part. These are stress only
ratings and are not intended for operation.
PARAMETER
SYMBOL
MIN
MAX
UNITS
NOTES
Pad Ring Supply Voltage
V
PAD
-0.3
4.1
V
Core Supply Voltage
V
CORE
-0.3
3.0
V
Input voltage (undershoot and overshoot)
V
IN
-0.5
V
PAD
+0.5
V
°
C
°
C
°
C
Storage Temperature
T
STG
-65
150
Junction Temperature under operation
T
J
125
1
Lead Soldering Temperature (10 seconds)
300
ESD Classification
Class 3A Human Body Model (4 kV) (JESD22-A114-B)
Class 4 Charged Device Model (1 kV) (JESD22-C101-A)
Moisture Sensitivity
Class 2
1. The circuit is designed for junction temperatures up to 125C. Sustained operation above 125C junction temperature will reduce long term
reliability.
Table 13: Recommended Operating Conditions
PARAMETER
SYMBOL
MIN
MAX
UNITS
NOTES
Pad Ring Supply Voltage
V
PAD
3.0
3.6
V
1
Core Supply Voltage
V
CORE
2.3
2.7
V
°
C
°
C
1
Temperature Ambient, no air flow
T
A
-40
+85
1
Junction Temperature
T
J
100
2
1. DC and AC specifications in Tables 15 and 16 are production tested over these ranges.
2. Thermal management may be required for full rate operation, See Table 22 below and Section 7.4.
Table 14: Thermal Data
THERMAL CONDUCTIVITY
SYMBOL
160 PBGA
UNITS
0.5 Watt
1 Watt
Theta Junction to Ambient
θ
JA
θ
JC
TBD
TBD
°
C/W
°
C/W
Theta Junction to Case
TBD
TBD
Note: Air flow will reduce
θ
ja
and is highly recommended.
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