參數(shù)資料
型號(hào): ADSP-21060LCWZ-160
廠商: ANALOG DEVICES INC
元件分類(lèi): 數(shù)字信號(hào)處理
英文描述: 48-BIT, 40 MHz, OTHER DSP, CQFP240
封裝: THERMALLY ENHANCED, METRIC, HEAT SINK, CERAMIC, QFP-240
文件頁(yè)數(shù): 37/48頁(yè)
文件大?。?/td> 481K
代理商: ADSP-21060LCWZ-160
–42–
ADSP-21060C/ADSP-21060LC
REV. B
LOAD CAPACITANCE – pF
0
20
40
60
80
100
120
Y = 0.0391X + 0.36
Y = 0.0305X + 0.24
RISE TIME
FALL TIME
140
160
180
200
RISE
AND
FALL
TIMES
ns
(0.8V
2.0V)
1
2
3
4
5
6
7
8
9
Figure 34. Typical Output Rise Time (0.8 V–2.0 V) vs.
Load Capacitance (VDD = 3.3 V)
ENVIRONMENTAL CONDITIONS
Thermal Characteristics
The ADSP-2106x is packaged in a 240-lead thermally enhanced
ceramic QFP (CQFP). There are two package versions, one
with a copper/tungsten heat slug on top of the package (CZ) for
air cooling, and one with the heat slug on the bottom (CW) for
cooling through the board. The ADSP-2106x is specified for a
case temperature (TCASE). To ensure that the TCASE data sheet
specification is not exceeded, a heatsink and/or an air flow
LOAD CAPACITANCE – pF
OUTPUT
DELAY
OR
HOLD
ns
5
–1
25
200
50
75
100
125
150
175
4
3
2
1
NOMINAL
Y = 0.0329X –1.65
Figure 35. Typical Output Delay or Hold vs. Load Capaci-
tance (at Maximum Case Temperature) (VDD = 3.3 V)
Airflow
(Linear Ft./Min.)
0
100
200
400
600
θCA (°C/W)
21060CW/LCW
19.5
16
14
12
10
21060CZ/LCZ
20
16
14
11.5
9.5
NOTES
This represents thermal resistance at total power of 5 W. With air flow, no variance is seen in
θ
CA of 5 W.
θ
CA at 0 LFM varies with power
21060CW/LCW: at 2 W,
θ
CA = 23
°C/W; at 3 W, θ
CA = 21.5
°C/W.
21060CZ/LCZ: at 2 W,
θ
CA = 24
°C/W; at 3 W, θ
CA = 21.5
°C/W.
θ
JC= 0.24
°C/W.
source may be used. A heatsink should be attached with a ther-
mal adhesive.
TCASE = TAMB + (PD
× θ
CA )
TCASE = Case temperature (measured on the heat slug surface)
PD =
Power dissipation in W (this value depends upon the
specific application; a method for calculating PD is
shown under Power Dissipation).
θ
CA =
Value from the following table.
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