參數(shù)資料
型號: SM320F2812HFGM
廠商: TEXAS INSTRUMENTS INC
元件分類: 數(shù)字信號處理
英文描述: 16-BIT, 150 MHz, OTHER DSP, CQFP172
封裝: NCTB, CERAMIC, QFP-172
文件頁數(shù): 127/147頁
文件大小: 1721K
代理商: SM320F2812HFGM
Development Support
80
December 2004
SGUS053
Predictions show that prototype devices ( TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package
type (for example, PBK) and temperature range (for example, A). Figure 51 provides a legend for reading
the complete device name for any TMS320x28x family member.
PREFIX
SM
320
F
2812
HFG
TMX = experimental device
TMP = prototype device
TMS = qualified device
SM = commercial processing
DEVICE FAMILY
320 = TMS320
DSP Family
TECHNOLOGY
PACKAGE TYPE
GHH = 179-ball MicroStar BGA
PGF = 176-pin LQFP
PBK = 128-pin LQFP
HFG = 172-pin CQFP
F = Flash EEPROM (1.8-V/1.9-V Core/3.3-V I/O)
C = ROM (1.8-V/1.9-V Core/3.3-V I/O)
DEVICE
2810
2811
2812
Not all combinations of processing options, temperature ranges and packages are available.
BGA =
Ball Grid Array
LQFP =
Low-Profile Quad Flatpack
CQFP =
Ceramic Quad Flatpack
TEMPERATURE RANGE
A
= 40
°C to 85°C
S
= 40
°C to 125°C
M
= 55
°C to 125°C
M
Figure 51. 28x Device Nomenclature
5.2
Documentation Support
Extensive documentation supports all of the TMS320
DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data sheets
and data manuals, with design specifications; and hardware and software applications. Useful reference
documentation includes:
TMS320C28x DSP CPU and Instruction Set Reference Guide (literature number SPRU430) describes the
central processing unit (CPU) and the assembly language instructions of the TMS320C28x
fixed-point
digital signal processors (DSPs). It also describes emulation features available on these DSPs.
TMS320x281x Analog-to-Digital Converter (ADC) Reference Guide (literature number SPRU060)
describes the ADC module. The module is a 12bit pipelined ADC. The analog circuits of this converter,
referred to as the core in this document, include the front-end analog multiplexers (MUXs), sampleandhold
(S/H) circuits, the conversion core, voltage regulators, and other analog supporting circuits. Digital circuits,
referred to as the wrapper in this document, include programmable conversion sequencer, result registers,
interface to analog circuits, interface to device peripheral bus, and interface to other on-chip modules.
TMS320x281x Boot ROM Reference Guide (literature number SPRU095) describes the purpose and
features of the bootloader (factory-programmed boot-loading software). It also describes other contents of the
device on-chip boot ROM and identifies where all of the information is located within that memory.
TMS320x281x Event Manager (EV) Reference Guide (literature number SPRU065) describes the EV
modules that provide a broad range of functions and features that are particularly useful in motion control and
motor control applications. The EV modules include general-purpose (GP) timers, full-compare/PWM units,
capture units, and quadrature-encoder pulse (QEP) circuits.
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