參數(shù)資料
型號(hào)： SAA5667HL/NNNN
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 微控制器/微處理器
英文描述： 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PQFP100
封裝： 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-407-1, LQFP-100
文件頁(yè)數(shù)： 9/112頁(yè)
文件大?。?/td> 537K
代理商： SAA5667HL/NNNN
2004 Sep 03
106
Philips Semiconductors
Product specication
Enhanced TV microcontrollers with
On-Screen Display (OSD)
SAA56xx
31 EMC GUIDELINES
Optimization of circuit return paths and minimization of
common mode emission will be assisted by using a double
sided printed-circuit board with low inductance ground
plane.
On a single sided printed-circuit board, a local ground
plane under the whole IC should be present, as shown in
Fig.46. This should be connected by the widest possible
connection back to the PCB ground connection, and bulk
electrolytic decoupling capacitor. It should preferably not
connect to other grounds on the way and no wire links
should be present in this connection. The use of wire links
increases ground bounce by introducing inductance into
the ground.
The supply pins can be decoupled at the pin to the ground
plane under the IC. This is easily accomplished using
surface mount capacitors, which are more effective than
leaded components at high frequency.
Using a device socket will unfortunately add to the area
and inductance of the external bypass loop.
A ferrite bead or inductor with resistive characteristics at
high frequencies may be utilised in the supply line close to
the decoupling capacitor to provide a high impedance.
To prevent pollution by conduction onto the signal lines
(which may then radiate), signals connected to the VDD
supply via a pull-up resistor should not be connected to the
IC side of this ferrite component.
Pin OSCGND should be connected only to the crystal load
capacitors and not the local or circuit GND.
Physical connection distances to associated active
devices should be short.
Output traces should be routed with close proximity
mutually coupled ground return paths.
handbook, full pagewidth
electrolytic decoupling capacitor (2
F)
ferrite beads
SM decoupling capacitors (10 to 100 nF)
under-IC GND plane
IC
MBK979
VSSC
VSSA
V
DDP
V
SSP
V
DDC
V
DDA
GND
+3.3 V
other
GND
connections
under-IC GND plane
GND connection
note: no wire links
Fig.46 Power supply connections for EMC.
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