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參數(shù)資料
| 型號(hào)： | pentium III |
| 廠商： | Intel Corp. |
| 英文描述： | pentium III Processor for the PGA370 Socket at 500MHz to 933MHz(工作頻率500到933兆赫茲活動(dòng)帶PGA370插孔奔III處理器) |
| 中文描述： | 奔騰III處理器在500MHz到933MHz的（工作頻率500到933兆赫茲活動(dòng)帶PGA370插孔奔三處理器的PGA370插座） |
| 文件頁數(shù)： | 62/78頁 |
| 文件大?。?/td> | 610K |
| 代理商： | PENTIUM III |
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62
Datasheet
Pentium
III Processor for the PGA370 Socket at 500 MHz to 933 MHz
6.0
Boxed Processor Specifications
The Intel
Pentium
III
processor for the PGA370 socket is also offered as an Intel boxed
processor. Intel boxed processors are intended for system integrators who build systems from
motherboards and standard components. The boxed Pentium
III
processor for the PGA370 socket
will be supplied with an unattached fan heatsink. This section documents motherboard and system
requirements for the fan heatsink that will be supplied with the boxed Pentium
III
processor. This
section is particularly important for OEMs that manufacture motherboards for system integrators.
Unless otherwise noted, all figures in this section are dimensioned in inches.
Figure 22
shows a
mechanical representation of the boxed Intel Pentium
III
processor for the PGA370 socket in the
Flip Chip Pin Grid Array (FC-PGA) package.
Note:
Drawings in this section reflect only the specifications on the Intel Boxed Processor product. These
dimensions should not be used as a generic keep-out zone for all heatsinks. It is the system
designer’s responsibility to consider their proprietary solution when designing to the required keep-
out zone on their system platform and chassis. Refer to the
Intel
Pentium
III
processor Enabling
Functional Specification
for further guidance. Contact your local Intel Sales Representative for this
document.
6.1
Mechanical Specifications
This section documents the mechanical specifications of the boxed Pentium
III
processor fan
heatsink.
6.1.1
Boxed Processor Thermal Cooling Solution Dimensions
The boxed processor ships with an unattached fan heatsink that has an integrated clip. Clearance is
required around the fan heatsink to ensure unimpeded airflow for proper cooling. Note that the
airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. The dimensions
for the boxed processor with integrated fan heatsink are shown in
Figure 23
and
Figure 24
. There
are two versions of the fan heatsink. The larger cooling solution (depicted on the right of
Figure 23
and
Figure 24
is required for Pentium
III
processors at frequencies of 866 MHz and above. General
spatial specifications are also outlined in
Table 31
. All dimensions are in inches.
Figure 22. Conceptual Boxed Intel
Pentium
III Processor for the PGA370 Socket
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