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參數(shù)資料
| 型號： | pentium III |
| 廠商： | Intel Corp. |
| 英文描述： | pentium III Processor for the PGA370 Socket at 500MHz to 933MHz(工作頻率500到933兆赫茲活動帶PGA370插孔奔III處理器) |
| 中文描述： | 奔騰III處理器在500MHz到933MHz的（工作頻率500到933兆赫茲活動帶PGA370插孔奔三處理器的PGA370插座） |
| 文件頁數(shù)： | 5/78頁 |
| 文件大?。?/td> | 610K |
| 代理商： | PENTIUM III |
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Datasheet
5
Pentium
III Processor for the PGA370 Socket at 500 MHz to 933 MHz
List of Figures
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Second Level (L2) Cache Implementation ...........................................................7
AGTL+ Bus Topology in a Uniprocessor Configuration ......................................12
AGTL+ Bus Topology in a Dual-Processor Configuration...................................12
Stop Clock State Machine...................................................................................12
Processor Vcc
CMOS
Package Routing................................................................16
BSEL[1:0] Example for a 100/133 MHz or 100 MHz Only System Design .........21
BCLK, PICCLK, and TCK Generic Clock Waveform...........................................33
System Bus Valid Delay Timings ........................................................................33
System Bus Setup and Hold Timings..................................................................33
System Bus Reset and Configuration Timings....................................................34
Power-On Reset and Configuration Timings.......................................................34
Test Timings (TAP Connection)..........................................................................35
Test Reset Timings .............................................................................................35
BCLK, PICCLK Generic Clock Waveform at the Processor Pins........................37
Low to High AGTL+ Receiver Ringback Tolerance.............................................38
Maximum Acceptable AGTL+ Overshoot/Undershoot Waveform.......................43
Non-AGTL+ Overshoot/Undershoot, Settling Limit, and Ringback 1 ..................43
Processor Functional Die Layout ........................................................................46
Package Dimensions...........................................................................................48
Top Side Processor Markings.............................................................................50
Intel
Pentium
III Processor Pinout...................................................................51
Conceptual Boxed Intel
Pentium
III Processor for the PGA370 Socket..........62
Side View of Space Requirements for the Boxed Processor..............................63
Side View of Space Requirements for the Boxed Processor..............................63
Dimensions of Mechanical Step Feature in Heatsink Base.................................64
Clip Keepout Requirements for Boxed Intel
Pentium
III Processors...............64
Boxed Processor Fan Heatsink Power Cable Connector Description.................65
Motherboard Power Header Placement Relative to the Boxed
Intel
Pentium
III Processor..............................................................................66
Thermal Airspace Requirement for all Boxed Intel
Pentium
III
Processor Fan Heatsinks in the PGA370 Socket................................................67
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