DS3106
89
12. Package Information
For the latest package outline information and land patterns, contact Microsemi timing products technical support.
Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different
suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND PATTERN NO.
64 LQFP
C64-1
13. Thermal Information
Table 13-1. LQFP Package Thermal Properties, Natural Convection
PARAMETER
MIN
TYP
MAX
Ambient Temperature (Note 1)
-40
°C
+85
°C
Junction Temperature
-40
°C
+125
°C
Theta-JA (
θ
JA) (Note 2)
45.4
°C/W
Psi-JB
23.8
°C/W
Psi-JT
0.3
°C/W
Note 1:
The package is mounted on a four-layer JEDEC standard test board with no airflow and dissipating maximum power.
Note 2:
Theta-JA (
θ
JA) is the junction to ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard
test board with no airflow and dissipating maximum power.
Table 13-2. LQFP Theta-JA (
θ
JA) vs. Airflow
FORCED AIR (METERS PER SECOND)
THETA-JA (
θ
JA)
0
45.4
°C/W
1
37.3
°C/W
2.5
34.5
°C/W