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參數(shù)資料
| 型號： | BX80551PG3000FN |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 3000 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | FLIP CHIP, LGA-775 |
| 文件頁數(shù)： | 98/106頁 |
| 文件大?。?/td> | 2713K |
| 代理商： | BX80551PG3000FN |
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Datasheet
91
Boxed Processor Specifications
7.1.2
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 550 grams. See Chapter 5 and the
Intel Pentium D Processor and Intel Pentium Processor Extreme Edition 840 Thermal and
Mechanical Design Guidelines for details on the processor weight and heatsink requirements.
7.1.3
Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly
The boxed processor thermal solution requires a heatsink attach clip assembly, to secure the
processor and fan heatsink in the baseboard socket. The boxed processor will ship with the heatsink
attach clip assembly.
7.2
Electrical Requirements
7.2.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. An attached fan power cable
will be shipped with the boxed processor to draw power from a power header on the baseboard.
The power cable connector and pinout are shown in Figure 7-5. Baseboards must provide a
matched power header to support the boxed processor. Table 7-1 contains specifications for the
input and output signals at the fan heatsink connector.
The fan heatsink outputs a SENSE signal that is an open- collector output that pulses at a rate of
2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to match the system board-
mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the
SENSE signal is not used, pin 3 of the connector should be tied to GND.
Figure 7-4. Overall View Space Requirements for the Boxed Processor
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