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參數(shù)資料
| 型號： | BX80551PG3000FN |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 3000 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | FLIP CHIP, LGA-775 |
| 文件頁數(shù)： | 36/106頁 |
| 文件大?。?/td> | 2713K |
| 代理商： | BX80551PG3000FN |
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Datasheet
35
Package Mechanical Specifications
3
Package Mechanical
Specifications
The Intel Pentium D processor is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package
that interfaces with the motherboard via an LGA775 socket. The package consists of a processor
core mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the
package substrate and core and serves as the mating surface for processor component thermal
solutions, such as a heatsink. Figure 3-1 shows a sketch of the processor package components and
how they are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for
complete details on the LGA775 socket.
The package components shown in Figure 3-1 include the following:
Integrated Heat Spreader (IHS)
Thermal Interface Material (TIM)
Processor core (die)
Package substrate
Capacitors
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-4. The drawings include
dimensions necessary to design a thermal solution for the processor. These dimensions include:
Package reference with tolerances (total height, length, width, etc.)
IHS parallelism and tilt
Land dimensions
Top-side and back-side component keep-out dimensions
Reference datums
All drawing dimensions are in mm [in].
Note:
Guidelines on potential IHS flatness variation with socket load plate actuation and installation of
the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.
Figure 3-1. Processor Package Assembly Sketch
System Board
LGA775 Socket
Capacitors
TIM
Core (die)
IHS
Substrate
P
Pk
A
bl
775
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