參數(shù)資料
型號: BX80551PG3000FN
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 3000 MHz, MICROPROCESSOR, PBGA775
封裝: FLIP CHIP, LGA-775
文件頁數(shù): 81/106頁
文件大小: 2713K
代理商: BX80551PG3000FN
76
Datasheet
Thermal Specifications and Design Considerations
Refer to the Intel Pentium D Processor and Intel Pentium Processor Extreme Edition 840
Thermal and Mechanical Design Guidelines and the Processor Power Characterization
Methodology for the details of this methodology.
The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates
that real applications are unlikely to cause the processor to consume maximum power dissipation for
sustained periods of time. Intel recommends that complete thermal solution designs target the
Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power
consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely
event that an application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal Monitor feature
must be enabled for the processor to remain within specification.
Table 5-1. Processor Thermal Specifications
Processor
Number
Core Frequency
(GHz)
Thermal Design
Power (W)
Minimum
TC (°C)
Maximum TC (°C)
Notes
805
2.66 GHz (PRB = 0)
95
5
820
2.80 GHz (PRB = 0)
95
5
830
3 GHz (PRB = 1)
130
5
1, 2
NOTES:
1.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum pow-
er that the processor can dissipate.
2.
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the
maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table
for the allowed combinations of power and TC.
840
3.20 GHz (PRB = 1)
130
5
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