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參數(shù)資料
| 型號： | BX80551PG3000FN |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 3000 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | FLIP CHIP, LGA-775 |
| 文件頁數(shù)： | 104/106頁 |
| 文件大?。?/td> | 2713K |
| 代理商： | BX80551PG3000FN |
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Datasheet
97
Balanced Technology Extended (BTX) Type I Boxed Processor Specifications
8
Balanced Technology Extended
(BTX) Type I Boxed Processor
Specifications
The Intel Pentium D processor will also be offered as an boxed Intel processor. Boxed Intel
processors are intended for system integrators who build systems from largely standard
components. The boxed Intel Pentium D processor will be supplied with a cooling solution known
as the Thermal Module Assembly (TMA). Figure 8-1 shows a mechanical representation of a
boxed Pentium D processor. This chapter documents mainboard and system requirements for the
TMA that will be supplied with the boxed Pentium D processor. This chapter is particularly
important for OEMs that manufacture mainboards for system integrators.
Note:
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches
[in brackets].
Note:
Drawings in this section reflect only the specifications on the boxed Intel processor product. These
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system
designer’s responsibility to consider their proprietary cooling solution when designing to the
required keep-out zone on their system platforms and chassis. Refer to the Intel Pentium D
Processor and Intel Pentium Processor Extreme Edition 840 Thermal and Mechanical Design
Guidelines for further guidance.
NOTE: The duct, clip, heatsink, and fan can differ from this drawing representation; however, the basic shape
and size will remain the same.
Figure 8-1. Mechanical Representation of the Boxed Processor
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