參數(shù)資料
型號(hào)： BX80551PG3000FN
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 3000 MHz, MICROPROCESSOR, PBGA775
封裝： FLIP CHIP, LGA-775
文件頁數(shù)： 106/106頁
文件大?。?/td> 2713K
代理商： BX80551PG3000FN
Datasheet
99
Balanced Technology Extended (BTX) Type I Boxed Processor Specifications
8.1.3
Boxed Processor Support and Retention Module (SRM)
The boxed processor TMA requires a SRM assembly to attach directly to the chassis base pan and
to secure the processor and TMA in the mainboard socket. The boxed processor TMA will ship
with the heatsink attach clip assembly, duct, and screws for attachment. The SRM must be supplied
by the chassis hardware vendor. See the Support and Retention Module (SRM) External Design
Requirements Document, Balanced Technology Extended (BTX) System Design Guide, and the
Intel Pentium D Processor and Intel Pentium Processor Extreme Edition 840 Thermal and
Mechanical Design Guidelines for more detailed design information regarding the support and
retention module.
8.2
Electrical Requirements
8.2.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be
shipped with the boxed processor to draw power from a power header on the baseboard. The power
cable connector and pinout are shown in Figure 8-4. Baseboards must provide a matched power
header to support the boxed processor. Table 8-1 contains specifications for the input and output
signals at the fan heatsink connector.
The fan heatsink outputs a SENSE signal that is an open- collector output that pulses at a rate of
2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to match the system board-
mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the
SENSE signal is not used, pin 3 of the connector should be tied to GND.
Figure 8-3. Assembly Stack Including the Support and Retention Module
T h erm a l M o dule A s s e m b ly
H e a ts in k & F a n
C lip
S tru c tu ra l D u c t
M o th erb o ard
SR M
C h a ssis P a n
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