參數(shù)資料
型號: BX80551PG3000FN
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 3000 MHz, MICROPROCESSOR, PBGA775
封裝: FLIP CHIP, LGA-775
文件頁數(shù): 3/106頁
文件大小: 2713K
代理商: BX80551PG3000FN
100
Datasheet
Balanced Technology Extended (BTX) Type I Boxed Processor Specifications
The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the connector
labeled as CONTROL.
Note:
The boxed processor’s fan heatsink requires a constant +12 V supplied to pin 2 and does not
support variable voltage control or 3-pin PWM control.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the platform
documentation, or on the system board itself. Figure 8-5 shows the location of the fan power
connector relative to the processor socket. The baseboard power header should be positioned
within 4.33 inches from the center of the processor socket.
NOTES:
1. Baseboard should pull this pin up to 5 V with a resistor.
2. Open Drain Type, Pulse Width Modulated.
3. Fan will have a pull-up resistor to 4.75 V, maximum 5.25 V.
Figure 8-4. Boxed Processor Fan Heatsink Power Cable Connector
Bd P
P
C bl
Pin
Signal
12 34
1
2
3
4
GND
+12 V
SENSE
CONTROL
Straight square pin, 4-pin terminal housing with
polarizing ribs and friction locking ramp.
0.100" pitch, 0.025" square pin width.
Match with straight pin, friction lock header on
mainboard.
Table 8-1. Fan Heatsink Power and Signal Specifications
Description
Min
Typ
Max
Unit
Notes
+12 V: 12 volt fan power supply
10.2
12
13.8
V
IC:
Peak Fan current draw
Fan start-up current draw
Fan start-up current draw maximum duration
1.0
1.5
2.0
1.0
A
Second
SENSE: SENSE frequency
2
pulses per fan
revolution
1
CONTROL
21
25
28
kHz
2,3
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