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參數(shù)資料
| 型號： | BX80551PG3000FN |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 3000 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | FLIP CHIP, LGA-775 |
| 文件頁數(shù)： | 4/106頁 |
| 文件大?。?/td> | 2713K |
| 代理商： | BX80551PG3000FN |
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Datasheet
101
Balanced Technology Extended (BTX) Type I Boxed Processor Specifications
8.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the boxed
processor.
8.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor temperature specification is
found in Chapter 5. The boxed processor TMA is able to keep the processor temperature within the
specifications listed in Table 5-1 for chassis that provide good thermal management. For the boxed
processor TMA to operate properly, it is critical that the airflow provided to the TMA is
unimpeded. Airflow of the TMA is into the duct and out of the rear of the duct in a linear flow.
Blocking the airflow to the TMA inlet reduces the cooling efficiency and decreases fan life. The air
temperature entering the fan should be kept below 35 °C. Meeting the processor's temperature
specification is the responsibility of the system integrator.
Figure 8-5. Balanced Technology Extended (BTX) Mainboard Power Header Placement
(hatched area)
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