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參數(shù)資料
| 型號： | BX80551PG3000FN |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 3000 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | FLIP CHIP, LGA-775 |
| 文件頁數(shù)： | 97/106頁 |
| 文件大?。?/td> | 2713K |
| 代理商： | BX80551PG3000FN |
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90
Datasheet
Boxed Processor Specifications
7.1
Mechanical Specifications
7.1.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Pentium D processor. The
boxed processor will be shipped with an unattached fan heatsink. Figure 7-1 shows a mechanical
representation of the boxed Pentium D processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in Figure 7-2 (Side View), and Figure 7-3 (Top View). The airspace requirements for the
boxed processor fan heatsink must also be incorporated into new baseboard and system designs.
Airspace requirements are shown in Figure 7-7 and Figure 7-8. Note that some figures have
centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.
NOTES:
1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical
representation.
Figure 7-2. Side View Space Requirements for the Boxed Processor (Applies to all four side
views)
Figure 7-3. Top View Space Requirements for the Boxed Processor
3.74
[95.0]
3.2
[81.3]
0.39
[10.0]
0.98
[25.0]
3.74
[95.0]
3.74
[95.0]
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