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參數(shù)資料
| 型號(hào)： | 22247J |
| 英文描述： | 3.3V EconoReset |
| 中文描述： | FBGA封裝用戶指南。版本4.2 |
| 文件頁(yè)數(shù)： | 93/97頁(yè) |
| 文件大?。?/td> | 2624K |
| 代理商： | 22247J |
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FBGA User’s Guide
92
Version 4.2, November 1, 2002
Revision F+1 (Version 2.3.1): July 30, 1999
Chapter 2
16 Mb Daisy Chain and Board Layout figures. Added new 99xx date code daisy chain schematic and
board layout. Added 98xx date code to previous drawings.
Revision G (Version 3.0): January 15, 2001
Chapter 2
Replaced all FGBA pinout figures with new illustrations.
Chapter 3
Updated package outline diagrams with specification 16-038-9 illustrations. Replaced Table 3-1
FBGA-BT with new information. Section on “FBGA Thermal Resistance Data” replaced with section
on “FBGA Thermal Management”.
Chapter 4
Added HDI information in the “General Design Considerations” section. Replaced “Routing
Dimensions” section with “Routing Recommendation” section. Added “gold thickness of 5 mils max
is recommended” to the “PC Board Surface Finish” subsection. Updated “Recommended Design
Values” in the table below Figure 4-2. Replaced “Routing Dimensions” and “Routing for 32-Megabit”
figure with “Example of Routing” figures.
Chapter 5
Replaced entire chapter with new information.
Appendix A
New article reprints.
Appendix B
New application note.
Revision G+1 (Version 3.1): March 12, 2001
Chapter 2—Daisy Chains
Added “
Both are listed in the Appendices.” to the end of the second paragraph.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 22249 | 3.3V EconoReset |
| 2225-4L | BJT |
| 22250 | 3.0 Volt-only Burst Mode Flash Memory Technology |
| 2225JAxxx | Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:18; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:18-11 RoHS Compliant: No |
| 2220Gxxx | High Voltage MLC Chip |
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| 2224-832-A-6 | 制造商:RAF Electronic Hardware 功能描述: |
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