參數(shù)資料
型號： 22247J
英文描述： 3.3V EconoReset
中文描述： FBGA封裝用戶指南。版本4.2
文件頁數(shù)： 18/97頁
文件大?。?/td> 2624K
代理商： 22247J
FBGA User’s Guide
Version 4.2, November 1, 2002
17
Chapter 4:
AMD Multi-Chip Packaging
In portable consumer product segment such as Cell phones, PDAs, digital cameras and audio players
there are demands to increase features and functionalities as well as for smaller, thinner product size.
In order to meet these demands, AMD launched a line of MCP (Multi-Chip Package) products.
Through system integration and PCB optimization, MCP enhances system design in numerous ways
such as reduce PCB size, lower PCB cost, reduce components, lighter weight, smaller system, increase
features and customer flexibility.
Package Construction
Figure 4-1. 2-Die MCP Construction
Figure 4-2. Same-Die Stack (SDS) MCP Construction
Solder Ball Pad
DIE
-
2
BT Resin Substrate
(FBGA)
Punch or Drill VIA
Gold
(standard)
1.4 mm MAX
Mold
(standard)
(standard)
0.3, 0.35mm
(FBGA)
DIE
-
1
0.8mm
Solder Mask
Bond Wire
Compound
Die Attach
Solder Ball Pad
DIE-2
BT Resin Substrate
1.0mm
(Fortified-BGA)
Punch or Drill VIA
Gold
(standard)
Mold
(standard)
(standard)
(Fortified-BGA)
DIE-1
Si Spacer
0.8mm
(FBGA)
Solder Mask
Bond Wire
1
1
Compound
Die Attach
0.45mm
(FBGA)
0.6mm
相關(guān)PDF資料
PDF描述
22249 3.3V EconoReset
2225-4L BJT
22250 3.0 Volt-only Burst Mode Flash Memory Technology
2225JAxxx Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:18; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:18-11 RoHS Compliant: No
2220Gxxx High Voltage MLC Chip
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
22248038-13 制造商:Amphenol Corporation 功能描述:22248038-13
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2224-832-A-6 制造商:RAF Electronic Hardware 功能描述:
2-22483-5 制造商:TE Connectivity 功能描述:CORD,COILED,RETRACT
2-22488-9 制造商:TE Connectivity 功能描述:SPRING,COMPRESSION - Bulk 制造商:TE CONNECTIVITY 功能描述:SPRING,COMPRESSION
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