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參數(shù)資料
| 型號： | 22247J |
| 英文描述： | 3.3V EconoReset |
| 中文描述： | FBGA封裝用戶指南。版本4.2 |
| 文件頁數(shù)： | 10/97頁 |
| 文件大?。?/td> | 2624K |
| 代理商： | 22247J |
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FBGA User’s Guide
Version 4.2, November 1, 2002
9
Chapter 2:
AMD Fine-Pitch Ball Grid Array (FBGA)
The AMD FBGA package family offers Flash memory designers significant reduction in board real
estate over Thin Small Outline Packages (TSOPs). In addition AMD FBGA packages provide many
advantages over other Flash memory supplies’ chip scale packages, sush as alternatives robust board
level reliability and smooth pinout migrations. The packages are available for several popular 1.8-volt
and 3.0-volt Flash memory densities. The FBGA packages are constructed similar to conventional IC
packages and are an extension of the proven BGA technologies. For PCB assembly, existing
equipment and proven manufacturing processes may be used.
Package Construction
AMD FBGA is constructed on rigid BT-Resin substrates. The die is mounted on the substrate and the
leads are bonded using gold wires. The device is encapsulated in plastic and solder balls are attached
to the bottom of the substrate.
Figure 2-1. FBGA Construction
Note: Package Height = 1.2 mm max.
The Impact of Die Size Changes on FBGA Package Size
There are many costs associated with the manufacturing of semiconductor devices: die cost, assembly
cost and testing costs just to name a few. The die cost typically has the most impact on the total
manufacturing cost. In order to drive down the cost of the final product, semiconductor manufacturers
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