參數(shù)資料
型號： 22247J
英文描述： 3.3V EconoReset
中文描述： FBGA封裝用戶指南。版本4.2
文件頁數(shù)： 50/97頁
文件大小： 2624K
代理商： 22247J
FBGA User’s Guide
Version 4.2, November 1, 2002
49
FBGA Package Materials Descriptions
Table 6.1: FBGA-BT
FBGA-BT Ball Attach Detail
The ball attach for the FBGA-BT package used a 0.4 mm pad size and a soldermask opening of
0.25 mm, therefore it is soldermask defined. The ball size is 0.3 mm nominal. Note that Figure 6-1
shows ball-to-package attach, not ball-to-printed circuit board attach.
Figure 6-1. FBGA Package Ball Attach Detail
Material Type
Thickness
(μm)
Material
Name
Young’s
Modulus (Pa)
CTE ppm/c
Poisson’s
Ratio
Mold Compound
530
SMT-B-1N
1.50E+10
1.60
0.25
Die Attach
25.4
QMI 536
1.24E+09
8.00
0.4
Silicon Die
254
Silicon
1.31E+11
2.60
0.28
Eutectic Solder
Ball
300
Sn/Pb 63/37
3.10E+10
2.40
0.4
Copper Metalli-
zation
27
Cu
1.21E+11
1.70
0.34
Wire
25.4
Gold
Pad Plating
13
NI
2.00E+11
1.34
0.31
Solder Resist
50
Epoxy Res-
in
2.75E+09
6.90
0.3
Substrate Core
200
BT resin
2.60E+10 (Ex = Ey);
1.10E+10 (Ez)
1.50 (CTEx = CTEy);
5.20 (CTEz)
0.11
copper pad
(0.4 mm)
ball size
(0.3 mm)
FBGA-BT
soldermask
opening
(0.25 mm)
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