- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄368854 > 22247J 3.3V EconoReset PDF資料下載
參數(shù)資料
| 型號(hào)： | 22247J |
| 英文描述： | 3.3V EconoReset |
| 中文描述： | FBGA封裝用戶指南。版本4.2 |
| 文件頁數(shù)： | 15/97頁 |
| 文件大小： | 2624K |
| 代理商： | 22247J |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁當(dāng)前第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁
FBGA User’s Guide
14
Version 4.2, November 1, 2002
Chapter 3:
AMD Fortified-BGA
New performance driven applications continues to demand high board level reliability packages from
Flash memories. In addition, as PCB designs become increasingly complex, assembly-friendly
package becomes more desirable. AMD’s Fortified-BGA for the Flash memory combines both
superior reliability beyond the standard requirements and ease-of-use in one single package. It is ideal
for telecom, networking, automotive and avionics applications.
Package Construction
AMD’s Fortified-BGA is offer in a single easy to use 13x11mm x 1.4mm Ht. Package size, with
0.6mm solder ball diameter at 1.0mm ball pitch. Designed around AMD's already robust FBGA
(0.8mm ball pitch), the Fortified-BGA uses industry proven BT-Substrate to lower the CTE mismatch
between the substrate and the PCB.
Figure 3-1. Fortified-BGA Construction
Note: Package Height = 1.4mm Max.
Effects of Solder Ball Diameter
It is well known in the industry that solder ball diameter has a direct affect on solder joint reliability
during temperature cycling. Lager solder balls typically yield higher standoff heights after board
assembly. The importance of higher standoff is easiest explained through CTE mismatch. As describe
in many papers, higher standoff typically yields higher solder joint reliability during temperature
cycling. AMD's Fortified-BGA currently has the largest solder ball size (0.6mm Diameters) of any
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 22249 | 3.3V EconoReset |
| 2225-4L | BJT |
| 22250 | 3.0 Volt-only Burst Mode Flash Memory Technology |
| 2225JAxxx | Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:18; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:18-11 RoHS Compliant: No |
| 2220Gxxx | High Voltage MLC Chip |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 22248038-13 | 制造商:Amphenol Corporation 功能描述:22248038-13 |
| 22248-1 | 制造商:TE Connectivity 功能描述:SCREW,SOCKET HEAD,SHOULDER - Bulk 制造商:TE CONNECTIVITY 功能描述:SCREW,SOCKET HEAD,SHOULDER |
| 2224-832-A-6 | 制造商:RAF Electronic Hardware 功能描述: |
| 2-22483-5 | 制造商:TE Connectivity 功能描述:CORD,COILED,RETRACT |
| 2-22488-9 | 制造商:TE Connectivity 功能描述:SPRING,COMPRESSION - Bulk 制造商:TE CONNECTIVITY 功能描述:SPRING,COMPRESSION |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。