- 您現在的位置：買賣IC網 > PDF目錄368854 > 22247J 3.3V EconoReset PDF資料下載
參數資料
| 型號： | 22247J |
| 英文描述： | 3.3V EconoReset |
| 中文描述： | FBGA封裝用戶指南。版本4.2 |
| 文件頁數： | 88/97頁 |
| 文件大?。?/td> | 2624K |
| 代理商： | 22247J |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁當前第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁
B-87
FBGA User’s Guide
please refer to “Reliability Evaluation of Chip Scale
Packages” by Ranjit Gannamani, Viswanath Valluri,
Sidharth, and MeiLu Zhang.
Currently AMD has three types of FBGA daisy chains:
Stitched Daisy Chains, Metal Mask Daisy Chains and
Substrate Daisy Chains. Since the main purpose is to
characterize assembly process and equipment, OEMs
typically have no preference on the type of daisy chain
used.
DESCRIPTIONS
Stitched Daisy Chains
The functional substrate is used with a dummy silicon
slug. Daisy chain patterns are produced by shorting
pairs of adjacent bond-fingers on the substrate via wire
bonding. There are no wire bonds from the dummy sil-
icon slug to the substrate.
Metal Mask Daisy Chains
The functional substrate is used with a special daisy
chained wafer. There is no active circuitry on the wafer,
only the simulated bond-pads. Adjacent bond-pads are
shorted via metal mask. Daisy chain patterns are pro-
duced by wire bonding the bond-fingers on the sub-
strate to the bond-pads on the wafer.
Substrate Daisy Chains
A dummy silicon slug is used with a special daisy
chained substrate. Shorting adjacent balls on the sub-
strate produces daisy chain patterns.
9 X 8 MM FINE PITCH-BGA (WC) DAISY CHAIN SCHEMATIC
Note:
a and b are input and output of the network.
12 X 6 MM 48-BALL FINE PITCH-BGA DAISY CHAIN SCHEMATIC
Note:
a and b are input and output of the network.
A
B
C
D
E
F
G
H
6
5
4
3
2
1
A
B
C
D
E
F
G
H
a
b
6
5
4
3
2
1
Package Connection (Bottom View)
Board Connection (Top View)
A
B
C
D
E
F
G
H
1
2
3
4
5
6
Package Connection (Bottom View)
Board Connection (Top View)
A
B
C
D
E
F
G
H
a
b
1
2
3
4
5
6
相關PDF資料 |
PDF描述 |
|---|---|
| 22249 | 3.3V EconoReset |
| 2225-4L | BJT |
| 22250 | 3.0 Volt-only Burst Mode Flash Memory Technology |
| 2225JAxxx | Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:18; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:18-11 RoHS Compliant: No |
| 2220Gxxx | High Voltage MLC Chip |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 22248038-13 | 制造商:Amphenol Corporation 功能描述:22248038-13 |
| 22248-1 | 制造商:TE Connectivity 功能描述:SCREW,SOCKET HEAD,SHOULDER - Bulk 制造商:TE CONNECTIVITY 功能描述:SCREW,SOCKET HEAD,SHOULDER |
| 2224-832-A-6 | 制造商:RAF Electronic Hardware 功能描述: |
| 2-22483-5 | 制造商:TE Connectivity 功能描述:CORD,COILED,RETRACT |
| 2-22488-9 | 制造商:TE Connectivity 功能描述:SPRING,COMPRESSION - Bulk 制造商:TE CONNECTIVITY 功能描述:SPRING,COMPRESSION |
發(fā)布緊急采購，3分鐘左右您將得到回復。