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參數(shù)資料
| 型號(hào)： | 22247J |
| 英文描述： | 3.3V EconoReset |
| 中文描述： | FBGA封裝用戶指南。版本4.2 |
| 文件頁數(shù)： | 59/97頁 |
| 文件大?。?/td> | 2624K |
| 代理商： | 22247J |
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FBGA User’s Guide
58
Version 4.2, November 1, 2002
Table 8.1: Moisture Sensitivity Levels
3. Three exposures to conditions to simulate passage through IR Convection Reflow. The first two
passes are intended to simulate the assembly of a double-sided board, and the third pass to
simulate a rework operation—as follows.
Ramp-up rate: +3
°
C/second max.
Temperature maintained at 125 ±25
°
C: 120 seconds max.
Time at maximum temperature: 10–20 seconds
Maximum temperature: 235+5/–0
°
C
Ramp-down rate: –6
°
C/second max.
Temperature Cycling
Temperature cycling is designed to simulate stress that the device may experience at temperature range
of –40°C to 150°C for 1000 cycles, at a rate of 3 cycles/hour.
HAST
Highly Accelerated Stress Test (HAST) is design to accelerate possible corrosion, delamination,
possible wirebond failure, and intermetallic growths. HAST is performed at constant temperature and
relative humidity for a duration of time. Example: 110°C/85% unbiased for 264 hours.
Thermal Shock
Thermal shock test the integrity of the device under extreme temperate gradients.
Level
Floor Life
Soak Requirements
Standard
Accelerated Equivalent
Time
Conditions
Time
(Hours)
Conditions
Time
(Hours)
Conditions
1
Unlimited
≤
30
°
C/85% RH
168
85
°
C/85% RH
2
1 Year
≤
30
°
C/60% RH
168
85
°
C/60% RH
2a
4 Weeks
≤
30
°
C/60% RH
696
30
°
C/60% RH
120
60
°
C/60% RH
3
168 Hours
≤
30
°
C/60% RH
192
30
°
C/60% RH
40
60
°
C/60% RH
4
72 Hours
≤
30
°
C/60% RH
96
30
°
C/60% RH
5
24 Hours
≤
30
°
C/60% RH
48/72
30
°
C/60% RH
6
6 Hours
≤
30
°
C/60% RH
6
30
°
C/60% RH
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| 22249 | 3.3V EconoReset |
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| 2225JAxxx | Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:18; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:18-11 RoHS Compliant: No |
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