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| 型號： | 22247J |
| 英文描述： | 3.3V EconoReset |
| 中文描述： | FBGA封裝用戶指南。版本4.2 |
| 文件頁數(shù)： | 75/97頁 |
| 文件大小： | 2624K |
| 代理商： | 22247J |
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FBGA User’s Guide
74
Version 4.2, November 1, 2002
FGBAs—The CSP of Choice for Flash Memories
MSG
FBGAs
FOR FLASH MEMORIES
When it comes to
package technology for
flash memories,
AMD can do anything
that can be done. We have
the licenses, the technology,
and the ability.
Bruce Schupp, NVD product marketing
a publication of the manufacturing services group
AMD RECENTLY PLAYED A
pivotal role in the emergence of
the FBGA (fine pitch ball grid
array) as the new chip scale pack-
age (CSP) of choice for flash
memory devices. This time two
years ago, the micro ball grid
array (
μ
BGA) was the only CSP
available for downsizing from
the larger, traditional leaded
packages used for flash memories
(such as the thin small outline
plastic (TSOP) package). That
changed last year when AMD be-
gan offering an FBGA design that
afforded so many advantages, it
put a fork in the package roadmap
for flash memories in automotive,
telecom, and new consumer
product applications (e.g., cellu-
lar phones, pagers, hand-held
computers, etc.). As this story
unfolds, you will see how AMD
persevered in the face of an estab-
lished preference for Intel’s
μ
BGA
to win overwhelming acceptance
of the FBGA as the preferred CSP
in these applications.
PACKAGE SIZE MATTERS
In applications where miniatur-
ization is a priority, CSPs are a
crucial stepping stone on the way
to direct chip attach (DCA), in
which the die is bonded directly
2000
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