參數(shù)資料
型號(hào)： 22247J
英文描述： 3.3V EconoReset
中文描述： FBGA封裝用戶指南。版本4.2
文件頁(yè)數(shù)： 16/97頁(yè)
文件大?。?/td> 2624K
代理商： 22247J
FBGA User’s Guide
Version 4.2, November 1, 2002
15
BGA package for Flash memory. As a result, AMD’s Fortified-BGA offers superior board level
reliability, during Temperature Cycling, compared to other competitor’s BGA packages. When
compared to a competitor’s 10x13mm BGA, the 64-Ball (8x8 matrix) Fortified-BGA is expected to
have a higher relative life by a factor of 4.3X, and the 80-Ball (8x10 matrix) Fortified-BGA is
expected be 4.6X higher relative life.
Fortified-BGA Migration and Transition
AMD’s Fortified-BGA has taken AMD’s tradition of simple pinout migration to higher density one
step further. It virtually allows migration between densities without new board designs.
Fortified-BGA’s 11x13mm package size is designed to host any Flash density up to 256Mb. This
concept greatly lowers cost for customers. By anticipating future density needs, customers can
virtually have one board design. Furthermore, this “one-package-fits-all” concept can also help trim
equipment cost. The same socket, test boards, handlers, traces etc. are now interchangeable between
densities. Thereby increases the useful life of equipments.
AMD's Fortified-BGA takes full advantage of the real estate underneath the package. With 1.0mm ball
pitch, PCB design rules can be more relaxed. At any drill or pad size, 1.0mm pitch provides more
clearance for traces and spaces. For example, either 5mil or 7mil trace and space design rules can by
used. More clearance also allows for larger via capabilities, ideal for multi-layer PCB designs.
Board assembly also benefits from 1.0mm ball pitch. AMD's Fortified-BGA is aligned with many
FPGAs and Micro-Controller in terms of ball pitch. This allows for less expensive PCB technology to
be used.
AMD's Fortified-BGA, in essence, simplifies customers' transition to BGA packages. It is a Low-
Cost, highly reliable CSP solution to TSOP and other traditional leaded packages.
Fortified-BGA (
F
BGA) Pinouts
All pinouts are shown top view, with balls facing down.
相關(guān)PDF資料
PDF描述
22249 3.3V EconoReset
2225-4L BJT
22250 3.0 Volt-only Burst Mode Flash Memory Technology
2225JAxxx Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:18; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:18-11 RoHS Compliant: No
2220Gxxx High Voltage MLC Chip
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2-22488-9 制造商:TE Connectivity 功能描述:SPRING,COMPRESSION - Bulk 制造商:TE CONNECTIVITY 功能描述:SPRING,COMPRESSION
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