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參數資料
| 型號： | 22247J |
| 英文描述： | 3.3V EconoReset |
| 中文描述： | FBGA封裝用戶指南。版本4.2 |
| 文件頁數： | 8/97頁 |
| 文件大?。?/td> | 2624K |
| 代理商： | 22247J |
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FBGA User’s Guide
Version 4.2, November 1, 2002
7
Chapter 1:
Introduction
There is a trend in the electron industry to miniaturize. From tower PCs to lap-tops to PocketPCs,
from giant cell phones to pager size handsets, the demand for smaller feature rich electronic devices
will continue for years to come.
The trend for Chip Scale Packages (CSP) have grown tremendously since their introduction.
Applications such as cell phones, home entertainments, automotive engine controllers and networking
equipments all have adopted CSP packages into their systems. To address the needs of different
applications such as small package size, reliability or migration compatibility, AMD offers three
families of CSP:
Fine-Pitch Ball Grid Array (FBGA), Fortified-BGA and Stacked-MCM
Table 1.1: Package Highlights
Package Highlights
Benefits
Target Applications
FBGA Package
Small Package
Ideal for space constraint PCB
designs
Ideal for application with space constraints.
Portable application such as mobile phones,
camcorders and PDAs would benefit most
1.2mm Max package
height
Ideal for low-provide application
BT-Resin
Superior board level reliability
Fortified-BGA
Uniform 11x13mm
Package size
Simple and smooth migration
and compatibility across densi-
ties up to 256Mb
Removes concerns for Automotive, Network-
ing, Telecom and other applications that de-
mand the highest board level reliabilities
1.0mm Ball Pitch
Allows for more relax PCB de-
sign rules
0.6mm Ball Diameter
Improves board level reliabilities
Stacked-MCM
Small Package size
Idea for space constrain PCB de-
signs
Enabling applications with increase memory
for higher performance without increase in
board space. Ideally suited for Camcorders,
mobile phones, PDAs and other wireless appli-
cations
1.4mm Max Height
Idea for low-profile applications
Combines Flash and
SRAM
Increase memory capacity with
no increase in board spaces
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