參數(shù)資料
型號(hào)： 22247J
英文描述： 3.3V EconoReset
中文描述： FBGA封裝用戶指南。版本4.2
文件頁(yè)數(shù)： 92/97頁(yè)
文件大小： 2624K
代理商： 22247J
FBGA User’s Guide
Version 4.2, November 1, 2002
91
Revision Summary
Revision E (Version 2.2): March 13, 1999
Chapter 2
Modified 32 and 64 Mb daisy chain and board layout drawings. 32 and 64 Mb pinout drawings now
show outrigger balls that are shorted.
Revision F (Version 2.3): May 17, 1999
Construction of the FBGA-BT figure
Revised the following callouts: Mold Compound (deleted “Multi-Functional”), Die Attach (deleted
“Non-conductive”), Solder Mask (deleted “50μ Nom”), Copper Foil (deleted “12μ”), Plating (deleted
thickness from Cu and Au).
FBGA Package Materials Descriptions
In the table, renamed the following parameters: Rigid Substrate; Molding Compound; Die Attach
Material. Deleted “Interposer” from Copper Metallization.
FBGA Ball Attach Detail
Clarified type of attach.
Component Level Testing, FBGA-BT
Changed JC-14.1-98-135, Level 2 qualifications is planned for Q2, 1999 to JCB-98-104. In the table,
added rows 4 through 6. In item 3, changed ramp-up rate to 3
°
C, time at max. temperature to 10–20
seconds.
FBGA-BT Component Level Test Results
Replaced and reformatted data in table.
Test Strategy
Deleted reference to data supplied to AMD weekly.
FBGA Package Marking
Added “D” technology designator. Revised explanatory table.
FBGA Package Dimensions
Renamed WE and WF designators to WG and WH, respectively.
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