參數(shù)資料
型號： W25Q16VSFIG
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 2M X 8 SPI BUS SERIAL EEPROM, PDSO16
封裝： 0.300 INCH, GREEN, PLASTIC, SOIC-16
文件頁數(shù)： 55/60頁
文件大?。?/td> 1438K
代理商： W25Q16VSFIG
W25Q16V
Publication Release Date: October 7, 2009
- 59 -
Revision E
14.
REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
10/20/06
New Create Advanced
A1
11/9/06
Various
Erase Suspend 10.2.21
tCHSH, tSHCH = 5nS
A2
11/15/06
49
tSHSL = 10ns for Read & 50ns for Write, Erase and
Program instructions
A3
2/22/07
20, 45, 49 & 57
Removed Octal Word Read Quad I/O Instruction.
Added transient voltage specification.
A4
4/20/07
19, 28, 30 & 45
Added Mode Bit Reset instruction and description.
A5
6/20/07
13, 15-17 & 23
Added note for SRP1,0 status during Power Lock-
Down protection.
Updated Status Register memory protection tables.
B
9/26/07
5, 11, 13, 15-17,
19, 35, 36, 43,
45-47, 50 & 59
Added note for Power Lock-Down, OTP functions.
Added note for 64 Bit unique ID.
Added note for 32KB/64KB block erase command.
Updated Mode Bit Reset command description.
Updated data retention temperature.
Updated tSHSL description, added tCLQV2.
Updated tBP1.
C
8/13/08
5, 18, 26, 28, 30,
31, 40, 45, 46,
50, 51, 57 & 58
Seperated W25Q16 & W25Q32.
Updated Features section.
Added Octal Word Read Quad I/O (E3h) Instruction.
Added note for HPM release (06h & B9h).
Added 50MHz clock frequency for E3h.
Updated Continuous Read Mode descriptions.
Updated tCLH, tCLL.
Updated chip erase time.
Updated Top Side Marking table.
Added note for WSON top side marking.
Removed preliminary designation.
D
08/20/09
17, 48 & 57
43
Removed HPM instruction
Updated Ordering Information
Updated package diagram
UID Waveform Correction
E
10/7/09
Table of Contents Error Correction
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PDF描述
W25Q32DWZPIP 256K X 16 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
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W25X16AVDAIZ 2M X 8 FLASH 2.7V PROM, PDIP8
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相關代理商/技術參數(shù)
參數(shù)描述
W25Q16VSSIG 功能描述:IC FLASH 16MBIT 80MHZ 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 產品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步，DDR II 存儲容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應商設備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ
W25Q16VZPIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q20BW 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 2M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q20BWSNIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 2M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q20BWSNIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 2M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
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