參數(shù)資料
型號: W25Q16VSFIG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 2M X 8 SPI BUS SERIAL EEPROM, PDSO16
封裝: 0.300 INCH, GREEN, PLASTIC, SOIC-16
文件頁數(shù): 37/60頁
文件大小: 1438K
代理商: W25Q16VSFIG
W25Q16V
- 42 -
10.2.25 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device
ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first
as shown in figure 26. The Device ID values for the W25Q16 is listed in Manufacturer and Device
Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and
then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously,
alternating from one to the other. The instruction is completed by driving /CS high.
Figure 26. Read Manufacturer / Device ID Diagram
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PDF描述
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相關代理商/技術(shù)參數(shù)
參數(shù)描述
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