參數資料
型號： MC56F8323
廠商： 飛思卡爾半導體(中國)有限公司
英文描述： 16-bit Hybrid Controller(16位混合控制器)
中文描述： 16位混合控制器（16位混合控制器）
文件頁數： 126/132頁
文件大?。?/td> 2202K
代理商： MC56F8323
126
56F8323 Technical Data
Preliminary
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, T
J
, can be obtained from the equation:
T
J
= T
A
+ (R
θ
J
Α
x
P
D
)
where:
= Ambient temperature for the package (
o
C)
R
θ
J
Α
= Junction-to-ambient thermal resistance (
o
C/W)
P
D
= Power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and
easy estimation of thermal performance. Unfortunately, there are two values in common usage: the
value determined on a single-layer board and the value obtained on a board with two planes. For
packages such as the PBGA, these values can be different by a factor of two. Which value is closer
to the application depends on the power dissipated by other components on the board. The value
obtained on a single layer board is appropriate for the tightly packed printed circuit board. The
value obtained on the board with the internal planes is usually appropriate if the board has
low-power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
R
θ
JA
= R
θ
JC
+ R
θ
CA
where:
R
θ
JC
is device related and cannot be influenced by the user. The user controls the thermal
environment to change the case-to-ambient thermal resistance, R
θ
CA
. For instance, the user can
change the size of the heat sink, the air flow around the device, the interface material, the mounting
arrangement on printed circuit board, or change the thermal dissipation on the printed circuit board
surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used,
the Thermal Characterization Parameter (
Ψ
JT
) can be used to determine the junction temperature
with a measurement of the temperature at the top center of the package case using the following
equation:
T
J
= T
T
+ (
Ψ
JT
x P
D
)
where:
Thermocouple temperature on top of package (
o
C)
Ψ
JT
=
P
D
=
Power dissipation in package (W)
T
A
R
θ
JA
R
θ
JC
R
θ
CA
= Package junction-to-ambient thermal resistance °C/W
= Package junction-to-case thermal resistance °C/W
= Package case-to-ambient thermal resistance °C/W
T
T
=
Thermal characterization parameter (
o
C)/W
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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相關代理商/技術參數
參數描述
MC56F8323EVM 功能描述:開發(fā)板和工具包 - 其他處理器 MC56F832X Dev Kit RoHS:否 制造商:Freescale Semiconductor 產品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MC56F8323EVM 制造商:Freescale Semiconductor 功能描述:Tools Development kit Kit Con
MC56F8323EVME 功能描述:開發(fā)板和工具包 - 其他處理器 MC56F8323 EVAL BRD RoHS:否 制造商:Freescale Semiconductor 產品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MC56F8323EVME 制造商:Freescale Semiconductor 功能描述:Evaluation Kit for MC56F832x and MC56F81
MC56F8323MFB60 功能描述:數字信號處理器和控制器 - DSP, DSC 60MHz 60MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
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