參數(shù)資料
型號(hào): ISL5416EVAL1
廠商: Intersil Corporation
英文描述: Four-Channel Wideband Programmable DownConverter
中文描述: 四通道可編程寬帶下變頻器
文件頁(yè)數(shù): 71/71頁(yè)
文件大?。?/td> 1128K
代理商: ISL5416EVAL1
71
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
ISL5416
Plastic Ball Grid Array Packages (BGA)
o
TOP VIEW
D
A1
BOTTOM VIEW
P
R
T
N
L
M
J
K
G
H
F
E
8
13
14
121110 9
CORNER
7 6 5
3
4
2
C
D
A
B
1
SIDE VIEW
SEATING PLANE
C
A
A1
A2
bbb
C
aaa
A1
E
A
B
E1
D1
b
S
ALL ROWS AND COLUMNS
S
M
A B
C
C
0.15
0.006
0.08M
A1
A1
CORNER I.D.
e
A
A
C
15
16
CORNER
CORNER I.D.
V256.17x17
256 BALL PLASTIC BALL GRID ARRAY PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.059
-
1.50
-
A1
0.012
0.016
0.31
0.41
-
A2
0.037
0.044
0.95
1.13
-
b
0.016
0.020
0.41
0.51
7
D/E
0.665
0.673
16.90
17.10
-
D1/E1
0.587
0.595
14.90
15.10
-
N
256
256
-
e
0.039 BSC
1.0 BSC
-
MD/ME
16 x 16
16 x 16
-
bbb
0.004
0.10
3
ααα
0.005
0.12
-
Rev. 2 01/03
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. Dimensioning and tolerancing conform to AMSE Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D” and
“E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spherical
crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body thick-
ness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter, paral-
lel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines the
position of the solder balls nearest to package centerlines. When
there is an even number of balls in the outer row the value is
“S” = e/2.
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