
57
Absolute Maximum Ratings
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 (core)
Thermal Information
Thermal Resistance (Typical)
256 Lead BGA Package. . . . . . . . . . . . . . . . . . . . . .
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150
o
C
Maximum Storage Temperature Range. . . . . . . . . . -65
o
C to 150
o
C
For recommended soldering conditions see Tech Brief 334.
4.6 (I/O’s)
Input, Output or I/O Voltage. . . . . . . . . . . . . . . . .GND -0.5V to 5.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class I
Operating Conditions
Voltage Range I/O, V
CCIO
. . . . . . . . . . . . . . . . .+3.135V to +3.465V
Voltage Range core, V
CCC
. . . . . . . . . . . . . . . . . .+1.71V to +1.89V
Temperature Range
Industrial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 2V to I/O V
CCIO
θ
JA
(
o
C/W)
31
28
26
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: NOTE
: θ
JA
is measured with the component mounted on a high effective thermal conductivity test board with “direct attach” features in free
air or with the airflow. See Tech Brief TB379 for details
Electrical Specifications
V
CCC
= Core supply: 1.8V
±
0.09V, T
A
= -40
o
C to 85
o
C, Industrial
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYPICAL
MAX
UNITS
Logical One Input Voltage
V
IH
V
CCIO
= 3.45V
2.0
V
Logical Zero Input Voltage
V
IL
V
CCIO
= 3.15V
0.8
V
Output High Voltage
V
OH
I
OH
= -2mA, V
CCC
= 3.15V
2.6
3
V
Output Low Voltage
V
OL
I
OL
= 2mA, V
CCC
= 3.15V
0.1
0.4
V
Input Leakage Current
I
I
V
IN
= V
CCIO
or GND, V
CCIO
= 3.465V
-10
< 1
(NOTE 3)
10
μ
A
Output Leakage Current
I
O
V
IN
= V
CCIO
or GND, V
CCIO
= 3.465V
-10
10
μ
A
Standby Power Supply Current
(core)
I
CCSB-CR
V
CCC
= 1.89V, See AC Test load circuit, No
CLK
12
(NOTE 6)
mA
Standby Power Supply Current
(IO’s)
I
CCSB-IO
V
CCC
= 1.89V, See AC Test load circuit,
No CLK
0.75
mA
Operating Power Supply Current
(core)
I
CCOP-CR
f = 80MHz, V
IN
= V
CCC
or GND,
V
CCC
= 1.89V, See AC Test load circuit,
660
mA
Operating Power Supply Current
(IO’s)
I
CCOP-IO
f = 80MHz, V
IN
= V
CCC
or GND,
V
CCC
= 1.89V, See AC Test load circuit,
150
mA
Operating Power Supply Core
Current (typical)
I
CCOP-TYP
f = 80MHz, V
IN
= V
CCC
or GND,
V
CCC
= 1.89V, See AC Test load circuit,
500
(NOTE 1, 4)
mA
Input Capacitance
C
IN
Freq = 1MHz, V
CCC
open, all measurements
are referenced to device ground
5
pF
(Note 2)
Output Capacitance
C
OUT
5
pF
(Note 2)
NOTES:
1. Power Supply current is proportional to frequency of operation and programmed configuration of the part. Typical rating for I
CCOP
is 6.5 mA/MHz.
2. Capacitance: T
A
= 25
o
C, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major
process or design changes.
3. Typical Pull-up/down resistance values are 60 k
.
4. Typical measured power on the Evaluation board:
. UMTS: CLK = 76.8 MHz, Total Power = 1.1 W (core current = 500 mA; I/O current = 60 mA)
. CDMA2000: CLK = 80 MHz, Total Power = 750 mW (core current = 360 mA; I/O current = 30 mA).
ISL5416