參數(shù)資料
型號： celeron CPU with Mobile Module
廠商： Intel Corp.
英文描述： processor Mobile Module Connector 2 (MMC-2) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器2處理器)
中文描述： 移動處理器模塊連接器2（MMC管理- 2），466 MHz和433MHz的（工作頻率466和433兆赫茲帶連接器2處理器）
文件頁數(shù)： 45/47頁
文件大小： 410K
代理商： CELERON CPU WITH MOBILE MODULE
Celeron
Processor Mobile Module MMC-2
at 466 MHz and 433 MHz
41
Hole detail, 3 places
0.762 mm width of EMI containment ring
1.27+/- 0.19 mm board edge to EMI ring
2.54+/-0.19 mm keep-out area
3.81+/-0.19 mm board edge to hole centerline
3.81+/-0.19 mm
4.45 mm diameter grounded ring
+ 0.050 mm
- 0.025 mm
hole diameter
2.413 mm
Figure 16. Standoff Holes, Board Edge Clearance, and EMI Containment Ring
5.3.2
Module Weight
The Celeron processor mobile module MMC-2 weighs
approximately 50 grams.
6.0
THERMAL SPECIFICATION
6.1
Thermal Design Power
The power handling capability of the system thermal solution
may be reduced to less than the recommended typical
thermal design power (TDP) with the implementation of
firmware/software control or “throttling”, which reduces the
CPU power consumption and dissipation. The typical TDP is
the typical power dissipation under normal operating
conditions at nominal V_CORE (CPU power supply) while
executing the worst case power instruction mix. This
includes the power dissipated by
all
of the relevant
components.
During all operating environments, the processor junction
temperature, T
, must be within the specified range of 0
Celsius to 100 Celsius.
6.2
Thermal Sensor Setpoint
The thermal sensor implements the SMBALERT# signal
described in the SMBus specification. SMBALERT# is
always asserted when the temperature of the processor core
thermal diode or the thermal sensor internal temperature
exceeds either the upper or lower temperature thresholds.
SMBALERT# may also be asserted if the measured
temperature equals either the upper or the lower threshold.
Table 26. Thermal Design Power Specification
Parameter
Typical
14.3W
Symbol
Notes
TDP
module
CPU Thermal Design Power
TDP
module
BX Thermal Design Power
2.5W
TDP
module
Module Thermal Design Power
17.4W
Module TDP = core, 82433BX, and voltage regulator
NOTE:
1.
During all operating environments, the processor temperature, TJ must be within the specified range of 0 Celsius to 100 Celsius.
TDPmodule is a thermal solution design reference point for OEM thermal solution readiness for total module power.
2.
相關(guān)PDF資料
PDF描述
Celeron Processor with mobile Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動模塊和連接器1處理器)
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