參數(shù)資料
型號： celeron CPU with Mobile Module
廠商： Intel Corp.
英文描述： processor Mobile Module Connector 2 (MMC-2) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器2處理器)
中文描述： 移動(dòng)處理器模塊連接器2（MMC管理- 2），466 MHz和433MHz的（工作頻率466和433兆赫茲帶連接器2處理器）
文件頁數(shù)： 3/47頁
文件大?。?/td> 410K
代理商： CELERON CPU WITH MOBILE MODULE
Celeron
Processor Mobile Module MMC-2
at 466 MHz and 433 MHz
i
CONTENTS
1.0 INTRODUCTION...........................................................1
1.1 Revision History......................................................1
2.0 ARCHITECTURE OVERVIEW......................................1
3.0 CONNECTOR INTERFACE..........................................3
3.1 Signal Definitions ....................................................3
3.1.1
Signal List...................................................4
3.1.2
Memory (109 Signals).................................5
3.1.3
AGP (60 Signals)........................................6
3.1.4
PCI (58 Signals)..........................................7
3.1.5
Geyserville (4 Signals)................................8
3.1.6
Processor/PIIX4E/M Sideband (8 Signals).9
3.1.7
Power Management (7 Signals)................10
3.1.8
Clock (9 Signals).......................................11
3.1.9
Voltages (54 Signals)................................12
3.1.10
ITP/JTAG (9 Signals)................................13
3.1.11
Miscellaneous (82 Signals).......................13
3.2 Connector Pin Assignments..................................14
3.3 Pin and Pad Assignments.....................................17
4.0 FUNCTIONAL DESCRIPTION....................................18
4.1 Celeron Processor Mobile Module MMC-2............18
4.2 L2 Cache..............................................................18
4.3 The 82433BX Host Bridge System Controller.......18
4.3.1
Memory Organization...............................18
4.3.2
Reset Strap Options .................................18
4.3.3
PCI Interface.............................................19
4.3.4
AGP Interface...........................................19
4.4 Power Management..............................................19
4.4.1
Clock Control Architecture........................19
4.4.2
Normal State.............................................21
4.4.3
Auto Halt State..........................................21
4.4.4
Stop Grant State.......................................21
4.4.5
Quick Start State.......................................21
4.4.6
HALT/Grant Snoop State..........................21
4.4.7
Sleep State...............................................21
4.4.8
Deep Sleep State......................................22
4.5 Typical POS/STR Power.......................................22
4.6 Electrical Requirements........................................23
4.6.1
DC Requirements .....................................23
4.6.2
AC Requirements......................................24
4.6.2.1
PSB Clock Signal Quality Specifications
and Measurement Guidelines .................25
4.7 Voltage Regulator.................................................25
4.7.1
Voltage Regulator Efficiency.....................25
4.7.2
Control of the Voltage Regulator...............26
4.7.2.1
Voltage Signal Definition and
Sequencing.............................................27
4.7.3
Power Planes: Bulk Capacitance
Requirements............................................28
4.7.4
Surge Current Guidelines .........................30
4.7.4.1
Slew-rate Control: Circuit Description.....32
4.7.4.2
Undervoltage Lockout: Circuit Description
(V_uv_lockout)........................................33
4.7.4.3
Overvoltage Lockout: Circuit Description
(V_ov_lockout)........................................33
4.7.4.4
Overcurrent Protection: Circuit Description34
4.8 Active Thermal Feedback.....................................35
4.9 Thermal Sensor Configuration Register................35
5.0 MECHANICAL SPECIFICATION................................35
5.1 Module Dimensions ..............................................35
5.1.2
Pin 1 Location of the MMC-2 Connector...37
5.1.3
Printed Circuit Board Thickness................37
5.1.4
Height Restrictions ...................................37
5.2 Thermal Transfer Plate..........................................38
5.3 Module Physical Support......................................40
5.3.1
Module Mounting Requirements ...............40
5.3.2
Module Weight..........................................41
6.0 THERMAL SPECIFICATION......................................41
6.1 Thermal Design Power.........................................41
6.2 Thermal Sensor Setpoint......................................41
7.0 LABELING INFORMATION.......................................42
8.0 ENVIRONMENTAL STANDARDS..............................43
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