參數(shù)資料
型號(hào): celeron CPU with Mobile Module
廠商: Intel Corp.
英文描述: processor Mobile Module Connector 2 (MMC-2) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器2處理器)
中文描述: 移動(dòng)處理器模塊連接器2(MMC管理- 2),466 MHz和433MHz的(工作頻率466和433兆赫茲帶連接器2處理器)
文件頁(yè)數(shù): 41/47頁(yè)
文件大?。?/td> 410K
代理商: CELERON CPU WITH MOBILE MODULE
Celeron
Processor Mobile Module MMC-2
at 466 MHz and 433 MHz
37
5.1.2
Pin 1 Location of the MMC-2 Connector
Figure 11 shows the location of pin 1 of the 400-pin
connector as referenced to the adjacent mounting hole.
Figure 11. Board Dimensions with 400-Pin Connector- Pin 1 Orientation
5.1.3
Printed Circuit Board Thickness
Figure 12 shows the minimum and maximum thickness of
the printed circuit board (PCB). The range of PCB thickness
allows for different PCB technologies to be used with current
and future Intel mobile modules.
Note:
The system manufacturer must ensure that the
mechanical restraining method and/or system-level EMI
contacts are able to support this range of PCB for
compatibility with future Intel mobile modules.
min: 0.90 mm
max: 1.10 mm
Printed circuit board
Figure 12. Printed Circuit Board Thickness
5.1.4
Height Restrictions
Figure 13 shows the mechanical stack-up and associated
component clearance requirements. This is the module
keep-out zone and should not be entered. The system
manufacturer establishes board-to-board clearance between
相關(guān)PDF資料
PDF描述
Celeron Processor with mobile Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動(dòng)模塊和連接器1處理器)
celeron processor 32 bit Celeron Processor Mobile Module(32 位帶移動(dòng)模塊處理器)
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