
ADuC7019/20/21/22/24/25/26/27/28
Rev. B | Page 16 of 92
ABSOLUTE MAXIMUM RATINGS
AGND = REFGND = DACGND = GNDREF,
TA = 25°C, unless otherwise noted.
Table 9.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
ESD CAUTION
Parameter
Rating
AVDD to IOVDD
0.3 V to +0.3 V
AGND to DGND
0.3 V to +0.3 V
IOVDD to IOGND, AVDD to AGND
0.3 V to +6 V
Digital Input Voltage to IOGND
0.3 V to +5.3 V
Digital Output Voltage to IOGND
0.3 V to IOVDD + 0.3 V
VREF to AGND
0.3 V to AVDD + 0.3 V
Analog Inputs to AGND
0.3 V to AVDD + 0.3 V
Analog Outputs to AGND
0.3 V to AVDD + 0.3 V
Operating Temperature Range, Industrial
–40°C to +125°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
150°C
θJA Thermal Impedance
40-Lead LFCSP
26°C/W
64-Lead LFCSP
24°C/W
64-Ball CSP_BGA
75°C/W
64-Lead LQFP
47°C/W
80-Lead LQFP
38°C/W
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
240°C
RoHS Compliant Assemblies
(20 sec to 40 sec)
260°C