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參數(shù)資料
| 型號(hào)： | TSB41BA3AIGGM |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | IEEE 1394b THREE-PORT CABLE TRANSCEIVER/ARBITER |
| 中文描述： | 的IEEE 1394b三端口電纜收發(fā)器/仲裁者 |
| 文件頁數(shù)： | 30/66頁 |
| 文件大?。?/td> | 895K |
| 代理商： | TSB41BA3AIGGM |
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SLLS618B JUNE 2004 REVISED AUGUST 2004
30
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
designing with PowerPAD
The TSB41BA3A is housed in a high performance, thermally enhanced, 80-terminal PFP PowerPAD
package. Use of the PowerPAD package does not require any special considerations except to note that the
PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical
conductor. Therefore, if not implementing PowerPAD PCB features, the use of solder masks (or other assembly
techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection
etches or vias under the package. The recommended option, however, is to not run any etches or signal vias
under the device, but to have only a grounded thermal land as explained below. Although the actual size of the
exposed die pad may vary, the maximum size required for the keepout area for the 80-terminal PFP PowerPAD
package is 10 mm
×
10 mm. The actual PowerPAD size for the TSB41BA3A is 6 mm
×
6 mm.
It is required that there be a thermal land, which is an area of solder-tinned-copper, underneath the PowerPAD
package. The thermal land varies in size, depending on the PowerPAD package being used, the PCB
construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not
contain numerous thermal vias depending on PCB construction.
Other requirements for thermal lands and thermal vias are detailed in the Texas Instruments
PowerPAD
Thermally Enhanced Package
application report (SLMA002) available via the Texas Instruments web pages
at URL: http://www.ti.com.
Figure 9. Example of a Thermal Land for the TSB41BA3A PHY
For the TSB41BA3A, this thermal land must be grounded to the low impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground terminal landing pads be connected directly to the grounded thermal land. The land size
ought to be as large as possible without shorting device signal terminals. The thermal land may be soldered
to the exposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low impedance ground plane for the device. More
information may be obtained from the Texas Instruments application note
PHY Layout
(SLLA020).
PowerPAD is a trademark of Texas Instruments.
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|---|---|
| TSB41BA3AIPFP | 功能描述:緩沖器和線路驅(qū)動(dòng)器 Three-Port Cable Xcvr/Arbiter RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| TSB41BA3APFP | 功能描述:緩沖器和線路驅(qū)動(dòng)器 Three-Port Cable Xcvr/Arbiter RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| TSB41BA3APFPG4 | 功能描述:1394 接口集成電路 Three-Port Cable Xcvr/Arbiter RoHS:否 制造商:Texas Instruments 類型:Link Layer Controller 工作電源電壓: 封裝 / 箱體:LQFP 封裝:Tray |
| TSB41BA3ATPFPEP | 功能描述:緩沖器和線路驅(qū)動(dòng)器 Mil Enh 3-Port Cable Xcvr/Arbiter RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| TSB41BA3B | 制造商:TI 制造商全稱:Texas Instruments 功能描述:IEEE 1394b THREE-PORT CABLE TRANSCEIVER/ARBITER |
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