參數(shù)資料
型號(hào): TMS0320F2810PBKAEP
廠商: Texas Instruments, Inc.
元件分類: 數(shù)字信號(hào)處理
英文描述: Digital Signal Processors
中文描述: 數(shù)字信號(hào)處理器
文件頁數(shù): 154/159頁
文件大?。?/td> 2084K
代理商: TMS0320F2810PBKAEP
Mechanical Data
152
March 2004 Revised October 2004
SGUS051A
7.2
Plastic Ball Grid Array
ZHH (SPBGAN179)
PLASTIC BALL GRID ARRAY
1,40 MAX
0,85
0,55
0,45
0,45
0,35
0,95
11,90
12,10
SQ
4204739/A 10/02
Seating Plane
7
B
A
2
1
C
D
F
E
G
4
3
6
5
N
M
K
J
H
L
P
9
8
11
10
13
12
14
0,40
10,40 TYP
0,40
A1 Corner
0,10
0,08
Bottom View
0,80
0,80
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. MicroStar BGA configuration.
D. This package is lead-free and needs a minimum reflow temperature of 250
°
C but not exceeding 260
°
C.
Table 72. Thermal Resistance Characteristics for 179-ZHH
PARAMETER
179-ZHH PACKAGE
UNIT
°
C/W
PsiJT
Θ
JA
Θ
JC
0.658
42.57
°
C/W
16.08
°
C/W
MicroStar BGA is a trademark of Texas Instruments.
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