參數(shù)資料
型號: ST72F324B
廠商: 意法半導(dǎo)體
英文描述: 5V Range 8-Bit MCU With 8 TO 32K FLASH/ROM, 10-Bit ADC, 4 Timers, SPI, SCI Interface(具有ICP,IAP,Nested Interrupt,TLI,ROP的8位MCU)
中文描述: 5V范圍內(nèi)的8位8到32K閃存/ ROM,10位ADC,4個計時器,SPI和SCI接口(具有比較方案,國際檢察官聯(lián)合會,嵌套中斷,中華語文研習(xí)所,人事登記的8位微控制器)
文件頁數(shù): 130/167頁
文件大小: 1641K
代理商: ST72F324B
ST72324B
130/167
1
12.8 EMC CHARACTERISTICS
Susceptibility tests are performed on a sample ba-
sis during product characterization.
12.8.1 Functional EMS (Electro Magnetic
Susceptibility)
Based on a simple running application on the
product (toggling 2 LEDs through I/O ports), the
product is stressed by two electro magnetic events
until a failure occurs (indicated by the LEDs).
ESD
: Electro-Static Discharge (positive and
negative) is applied on all pins of the device until
a functional disturbance occurs. This test
conforms with the IEC 1000-4-2 standard.
FTB
: A Burst of Fast Transient voltage (positive
and negative) is applied to V
DD
and V
SS
through
a 100pF capacitor, until a functional disturbance
occurs. This test conforms with the IEC 1000-4-
4 standard.
A device reset allows normal operations to be re-
sumed. The test results are given in the table be-
low based on the EMS levels and classes defined
in application note AN1709.
12.8.1.1 Designing hardened software to avoid
noise problems
EMC characterization and optimization are per-
formed at component level with a typical applica-
tion environment and simplified MCU software. It
should be noted that good EMC performance is
highly dependent on the user application and the
software in particular.
Therefore it is recommended that the user applies
EMC software optimization and prequalification
tests in relation with the EMC level requested for
his application.
Software recommendations:
The software flowchart must include the manage-
ment of runaway conditions such as:
– Corrupted program counter
– Unexpected reset
– Critical Data corruption (control registers...)
Prequalification trials:
Most of the common failures (unexpected reset
and program counter corruption) can be repro-
duced by manually forcing a low state on the RE-
SET pin or the Oscillator pins for 1 second.
To complete these trials, ESD stress can be ap-
plied directly on the device, over the range of
specification values. When unexpected behaviour
is detected, the software can be hardened to pre-
vent unrecoverable errors occurring (see applica-
tion note AN1015)
.
Symbol
Parameter
Conditions
Level/
Class
V
FESD
Voltage limits to be applied on any I/O pin to induce a
functional disturbance
32K Flash or ROM device, V
DD
=
5V,
T
A
=
+25°C, f
OSC
=
8MHz
conforms to IEC 1000-4-2
8 or 16K ROM device, V
DD
=
5V, T
A
=
+25°C,
f
OSC
=
8MHz conforms to IEC 1000-4-2
8 or 16K Flash device, V
DD
=
5V,
T
A
=
+25°C, f
OSC
=
8MHz conforms to IEC
1000-4-2
3B
4A
4B
V
FFTB
Fast transient voltage burst limits to be applied
through 100pF on V
DD
and V
DD
pins to induce a func-
tional disturbance
V
DD
=
5V, T
A
=
+25°C, f
OSC
=
8MHz
conforms to IEC 1000-4-4
4A
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