參數(shù)資料
型號： SM320F28335GHHAEP
廠商： Texas Instruments
文件頁數(shù)： 91/167頁
文件大小： 0K
描述： IC DIGITAL SIGNAL CTLR 179-BGA
產(chǎn)品培訓(xùn)模塊： ControlSUITE
Motor Signal Chain Overview
TPS75005 Single IC Power for C2000 MCU
標(biāo)準(zhǔn)包裝： 189
系列： TMS320F28x3x Delfino™, C2000™
核心處理器： C28x
芯體尺寸： 32-位
速度： 150MHz
連通性： CAN，EBI/EMI，I²C，McBSP，SCI，SPI，UART/USART
外圍設(shè)備： DMA，POR，PWM，WDT
輸入/輸出數(shù)： 88
程序存儲器容量： 512KB（256K x 16）
程序存儲器類型： 閃存
RAM 容量： 34K x 16
電壓 - 電源 (Vcc/Vdd)： 1.805 V ~ 1.995 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 16x12b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 179-LFBGA
包裝： 托盤
產(chǎn)品目錄頁面： 718 (CN2011-ZH PDF)
其它名稱： 296-25243
SPRS581D – JUNE 2009 – REVISED MAY 2012
4.7.3
ADC Calibration
................................................................................................. 74
4.8
Multichannel Buffered Serial Port (McBSP) Module
.................................................................. 75
4.9
Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
.................................... 78
4.10
Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C)
.......................................... 83
4.11
Serial Peripheral Interface (SPI) Module (SPI-A)
..................................................................... 86
4.12
Inter-Integrated Circuit (I2C)
............................................................................................. 89
4.13
GPIO MUX
................................................................................................................. 90
4.14
External Interface (XINTF)
............................................................................................... 97
5
Device Support
................................................................................................................. 99
6
Electrical Specifications
..................................................................................................... 99
6.1
Absolute Maximum Ratings
.............................................................................................. 99
6.2
Recommended Operating Conditions
................................................................................. 101
6.3
Electrical Characteristics
................................................................................................ 101
6.4
Current Consumption
.................................................................................................... 102
6.4.1
Reducing Current Consumption
............................................................................. 103
6.4.2
Current Consumption Graphs
............................................................................... 104
6.4.3
Thermal Design Considerations
............................................................................. 105
6.5
Emulator Connection Without Signal Buffering for the DSP
....................................................... 105
6.6
Timing Parameter Symbology
.......................................................................................... 107
6.6.1
General Notes on Timing Parameters
...................................................................... 107
6.6.2
Test Load Circuit
.............................................................................................. 107
6.6.3
Device Clock Table
........................................................................................... 107
6.7
Clock Requirements and Characteristics
............................................................................. 109
6.8
Power Sequencing
....................................................................................................... 110
6.8.1
Power Management and Supervisory Circuit Solutions
.................................................. 110
6.9
General-Purpose Input/Output (GPIO)
................................................................................ 113
6.9.1
GPIO - Output Timing
........................................................................................ 113
6.9.2
GPIO - Input Timing
.......................................................................................... 114
6.9.3
Sampling Window Width for Input Signals
................................................................. 115
6.9.4
Low-Power Mode Wakeup Timing
.......................................................................... 116
6.10
Enhanced Control Peripherals
......................................................................................... 120
6.10.1
Enhanced Pulse Width Modulator (ePWM) Timing
....................................................... 120
6.10.2
Trip-Zone Input Timing
....................................................................................... 120
6.11
External Interrupt Timing
................................................................................................ 122
6.12
I2C Electrical Specification and Timing
............................................................................... 123
6.13
Serial Peripheral Interface (SPI) Timing
.............................................................................. 123
6.13.1
Master Mode Timing
.......................................................................................... 123
6.13.2
SPI Slave Mode Timing
...................................................................................... 127
6.14
External Interface (XINTF) Timing
..................................................................................... 130
6.14.1
USEREADY = 0
............................................................................................... 130
6.14.2
Synchronous Mode (USEREADY = 1, READYMODE = 0)
............................................. 131
6.14.3
Asynchronous Mode (USEREADY = 1, READYMODE = 1)
............................................ 131
6.14.4
XINTF Signal Alignment to XCLKOUT
..................................................................... 133
6.14.5
External Interface Read Timing
............................................................................. 134
6.14.6
External Interface Write Timing
............................................................................. 135
6.14.7
External Interface Ready-on-Read Timing With One External Wait State
............................ 137
6.14.8
External Interface Ready-on-Write Timing With One External Wait State
............................. 140
6.14.9
XHOLD and XHOLDA Timing
............................................................................... 143
6.15
On-Chip Analog-to-Digital Converter
.................................................................................. 146
6.15.1
ADC Power-Up Control Bit Timing
.......................................................................... 147
6.15.2
Definitions
...................................................................................................... 148
6.15.3
Sequential Sampling Mode (Single-Channel) (SMODE = 0)
............................................ 149
6.15.4
Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
.......................................... 150
Copyright 2009–2012, Texas Instruments Incorporated
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SM320F28335GJZMEP 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC EP Digital Signal Controller RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
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