XCLKOUT(B) XCLKIN(A) C5 C9 C10 C1 C8 C6 SM320F2833" />
參數(shù)資料
型號: SM320F28335GHHAEP
廠商: Texas Instruments
文件頁數(shù): 14/167頁
文件大?。?/td> 0K
描述: IC DIGITAL SIGNAL CTLR 179-BGA
產(chǎn)品培訓(xùn)模塊: ControlSUITE
Motor Signal Chain Overview
TPS75005 Single IC Power for C2000 MCU
標(biāo)準(zhǔn)包裝: 189
系列: TMS320F28x3x Delfino™, C2000™
核心處理器: C28x
芯體尺寸: 32-位
速度: 150MHz
連通性: CAN,EBI/EMI,I²C,McBSP,SCI,SPI,UART/USART
外圍設(shè)備: DMA,POR,PWM,WDT
輸入/輸出數(shù): 88
程序存儲器容量: 512KB(256K x 16)
程序存儲器類型: 閃存
RAM 容量: 34K x 16
電壓 - 電源 (Vcc/Vdd): 1.805 V ~ 1.995 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 16x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 179-LFBGA
包裝: 托盤
產(chǎn)品目錄頁面: 718 (CN2011-ZH PDF)
其它名稱: 296-25243
C4
C3
XCLKOUT(B)
XCLKIN(A)
C5
C9
C10
C1
C8
C6
SPRS581D – JUNE 2009 – REVISED MAY 2012
A.
The relationship of XCLKIN to XCLKOUT depends on the divide factor chosen. The waveform relationship shown is
intended to illustrate the timing parameters only and may differ based on actual configuration.
B.
XCLKOUT configured to reflect SYSCLKOUT.
Figure 6-6. Clock Timing
6.8
Power Sequencing
No requirements are placed on the power up/down sequence of the various power pins to ensure the
correct reset state for all the modules. However, if the 3.3-V transistors in the level shifting output buffers
of the I/O pins are powered prior to the 1.9-V transistors, it is possible for the output buffers to turn on,
causing a glitch to occur on the pin during power up. To avoid this behavior, power the VDD pins prior to or
simultaneously with the VDDIO pins, ensuring that the VDD pins have reached 0.7 V before the VDDIO pins
reach 0.7 V.
There are some requirements on the XRS pin:
1. During power up, the XRS pin must be held low for tw(RSL1) after the input clock is stable (see Table 6-
10). This is to enable the entire device to start from a known condition.
2. During power down, the XRS pin must be pulled low at least 8
μs prior to VDD reaching 1.5 V. This is to
enhance flash reliability.
Additionally it is recommended that no voltage larger than a diode drop (0.7 V) should be applied to any
pin prior to powering up the device. Voltages applied to pins on an unpowered device can bias internal P-
N junctions in unintended ways and produce unpredictable results.
6.8.1
Power Management and Supervisory Circuit Solutions
Table 6-9 lists the power management and supervisory circuit solutions for 2833x/2823x devices. LDO
selection depends on the total power consumed in the end application. Go to www.ti.com and click on
Power Management for a complete list of TI power ICs or select the Power Management Selection Guide
link for specific power reference designs.
Table 6-9. Power Management and Supervisory Circuit Solutions
SUPPLIER
TYPE
PART
DESCRIPTION
Texas Instruments
LDO
TPS767D301
Dual 1-A low-dropout regulator (LDO) with supply voltage supervisor (SVS)
Texas Instruments
LDO
TPS70202
Dual 500/250-mA LDO with SVS
Texas Instruments
LDO
TPS766xx
250-mA LDO with PG
Texas Instruments
SVS
TPS3808
Open Drain SVS with programmable delay
Texas Instruments
SVS
TPS3803
Low-cost Open-drain SVS with 5
μS delay
Texas Instruments
LDO
TPS799xx
200-mA LDO in WCSP package
Texas Instruments
LDO
TPS736xx
400-mA LDO with 40 mV of VDO
Texas Instruments
DC/DC
TPS62110
High Vin 1.2-A dc/dc converter in 4x4 QFN package
Texas Instruments
DC/DC
TPS6230x
500-mA converter in WCSP package
110
Electrical Specifications
Copyright 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): SM320F28335-EP
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