參數(shù)資料
型號(hào)： PC8245
廠商： Atmel Corp.
英文描述： Integrated Processor Family
中文描述： 綜合處理器系列
文件頁數(shù)： 18/61頁
文件大?。?/td> 429K
代理商： PC8245
18
PC8245
2171D–HIREL–06/04
Internal Package Conduction
Resistance
For the TBGA, cavity down, packaging technology, shown in Figure 6 , the intrinsic con-
duction thermal resistance paths are as follows:
the die junction-to-case thermal resistance,
the die junction-to-ball thermal resistance.
Figure 6 depicts the primary heat transfer path for a package with an attached heat sink
mounted to a printed-circuit board.
Figure 6.
TBGA Package with Heat Sink Mounted to a Printed-Circuit Board
For this die-up, wire-bond TBGA package, heat generated on the active side of the chip
is conducted mainly through the mold cap, the heat sink attach material (or thermal
interface material), and finally through the heat sink where it is removed by forced-air
convection.
Adhesives and Thermal
Interface Materials
A thermal interface material is recommended between the top of the mold cap and the
bottom of the heat sink to minimize the thermal contact resistance. For those applica-
tions where the heat sink is attached by spring clip mechanism, Figure 7 shows the
thermal performance of three thin-sheet thermal-interface materials (silicone, graph-
ite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with
increasing contact pressure. The use of thermal grease significantly reduces the inter-
face thermal resistance. That is, the bare joint results in a thermal resistance
approximately seven times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-
circuit board (see Figure 7). Therefore, the synthetic grease offers the best thermal per-
formance, considering the low interface pressure. Of course, the selection of any
thermal interface material depends on many factors: thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
External Resistance
External Re sistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Mold Cap
Die/Substrate/C5 Solder Balls
Die Junction
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