參數(shù)資料
型號： PC8245
廠商： Atmel Corp.
英文描述： Integrated Processor Family
中文描述： 綜合處理器系列
文件頁數(shù)： 14/61頁
文件大小： 429K
代理商： PC8245
14
PC8245
2171D–HIREL–06/04
Figure 3 shows the undershoot and overshoot voltage of the memory interface of the
PC8245.
Figure 3.
Overshoot/Undershoot Voltage
Thermal Characteristics
Table 2 provides the package thermal characteristics for the PC8245. For further infor-
mation, see Section “Thermal Management Information” on page 15.
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the cold plate used for case temperature.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction tempera-
ture per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-
JT.
GVdd_OVvdd + 5%
GVdd_OVdd
4V
VIH
VIL
GND/GNDRING Q - 1.0V
GND/GNDRING - 0.3V
GND/GNDRING
Not to exceed 10%
of tSDRAM_CLK
Table 2.
Thermal Characterization Data
Symbol
Characteristic
Value
Unit
R
θ
JA
Junction-to-ambient natural convection (Single-layer board—1s)
(1)(2)
16.1
°
C/W
R
θ
JMA
Junction-to-ambient natural convection (Four-layer board—2s2p)
(1)(3)
12.0
°
C/W
R
θ
JMA
Junction-to-ambient (at 200 ft/min) (Single-layer board—1s)
(1)(3)
11.6
°
C/W
R
θ
JMA
Junction-to-ambient (at 200 ft/min)(Four layer board—2s2p)
(1)(3)
9.0
°
C/W
R
θ
JB
Junction-to-Board
(4)
4.8
°
C/W
R
θ
JC
Ψ
JT
Junction-to-Case
(5)
1.8
°
C/W
Junction-to-package top (natural convection)
(6)
1.0
°
C/W
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